A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

A ceramic electronic component includes a multilayer structure including dielectric layers and internal electrode layers, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other. A rare earth element of a side margin has an ionic radius smaller than that of a rare earth element of a capacity section. The rare earth element of the side margin is a rare earth element when only the rare earth element is added to the side margin, or a rare earth element with a largest amount when rare earth elements are added to the side margin. The rare earth element of the capacity section is a rare earth element when only the rare earth element is added to the capacity section, or a rare earth element with a largest amount when rare earth elements are added to the capacity section.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

The present invention provides a zirconia sintered body that has less excess material to be removed when making a prosthesis by milling, providing a reduction of work time, more durability for a working tool, and a faster treatment for patients, and that undergoes little deformation during firing, and provides enhanced aesthetics. The present invention relates to a columnar zirconia sintered body having a base and a side face, the base having a surface shape that is neither square nor rectangular but has at least one straight portion.

A method for treating a field operated component is disclosed which includes providing the component including a ceramic matrix composite and removing a first portion of the component, forming a first exposed surface on the component. The method further includes providing a second portion including the composite, the second portion having a second exposed surface including a conformation adapted to mate with the first exposed surface. The second portion is positioned in association with the component so as to replace the first portion, and the second portion and the component are joined to form a treated component. Another method is disclosed wherein the component is a turbine component which further includes removing an environmental barrier coating from the component, arranging and conforming the first exposed surface and the second exposed surface to define a joint, and applying an environmental barrier coating to the treated component.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

A second mold is placed on a planar surface of a first mold to form a first mold cavity, which is filled with a first material slurry containing a first material powder and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different from the first material powder so as to mold the slurry in contact with the first molded part. The molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold.

A method of manufacturing a gas turbine engine component (10) and the component so formed. The method includes: stacking a plurality of CMC layers (16) along a metal core (30) to form a stack of disconnected CMC layers, wherein adjacent edge faces (46) of the layers define a surface (44); additively depositing ceramic material (14) to only selected portions of the surface (44) to bond together at least some of the layers at their respective edge faces; and selecting locations for the depositing of the ceramic material to achieve a predetermined mechanical characteristic of the resulting component.

Various embodiments include a method for producing a ceramic insulator for a high-voltage or medium-voltage switching system comprising: attaching a base material for an equipotential layer between two axially symmetrical ceramic structural elements; disposing the electrically conductive equipotential layer between the two ceramic structural elements; and joining the two ceramic structural elements to form a unitary body along a symmetry axis of a first of the two elements.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.