C04B35/64

Ceramic slurries with photoreactive-photostable hybrid binders

Ceramic slurries may include ceramic particles, a photoreactive-photostable hybrid binder, and a photoinitiator. The photoreactive-photostable hybrid binder may include a photoreactive organic resin component, a photoreactive siloxane component, and one or more photostable siloxane components. Methods of forming a ceramic part may include curing a portion of a ceramic slurry by exposing the portion of the ceramic slurry to light to form a green ceramic part, and partially firing the green ceramic part to form a brown ceramic part. The brown ceramic part may be sintered at or above a sintering temperature of the ceramic particles to form a ceramic part, wherein sintering includes heating the brown ceramic part to a sufficient temperature to promote reaction bonding that converts silica from the photoreactive-photostable hybrid binder into silicates that bond with the ceramic particles.

Ceramic slurries with photoreactive-photostable hybrid binders

Ceramic slurries may include ceramic particles, a photoreactive-photostable hybrid binder, and a photoinitiator. The photoreactive-photostable hybrid binder may include a photoreactive organic resin component, a photoreactive siloxane component, and one or more photostable siloxane components. Methods of forming a ceramic part may include curing a portion of a ceramic slurry by exposing the portion of the ceramic slurry to light to form a green ceramic part, and partially firing the green ceramic part to form a brown ceramic part. The brown ceramic part may be sintered at or above a sintering temperature of the ceramic particles to form a ceramic part, wherein sintering includes heating the brown ceramic part to a sufficient temperature to promote reaction bonding that converts silica from the photoreactive-photostable hybrid binder into silicates that bond with the ceramic particles.

Method of manufacturing CMC components using boron carbide
11578774 · 2023-02-14 · ·

A method of manufacturing a ceramic matrix composite component includes pressure casting a fibrous preform with a slurry comprising boron carbide and densifying the fibrous preform using a liquid source of carbon. The method may include forming holes in the fibrous preform before pressure casting the fibrous preform with the slurry. The method may also include sintering the boron carbide after the pressure casting. In various embodiments, the sintering may be performed before the densifying.

Method of manufacturing CMC components using boron carbide
11578774 · 2023-02-14 · ·

A method of manufacturing a ceramic matrix composite component includes pressure casting a fibrous preform with a slurry comprising boron carbide and densifying the fibrous preform using a liquid source of carbon. The method may include forming holes in the fibrous preform before pressure casting the fibrous preform with the slurry. The method may also include sintering the boron carbide after the pressure casting. In various embodiments, the sintering may be performed before the densifying.

Multilayer electronic component and method for manufacturing multilayer electronic component

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C.sub.1 in the entire electrode facing portion satisfies about 10 wtppm<C.sub.1<about 50 wtppm. On an imaginary central axis line, a Cl concentration C.sub.2 in a central portion of the electrode facing portion and a Cl concentration C.sub.3 in both end portions of the electrode facing portion satisfy about 0.5C.sub.2≤C.sub.3<C.sub.2.

Multilayer electronic component and method for manufacturing multilayer electronic component

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C.sub.1 in the entire electrode facing portion satisfies about 10 wtppm<C.sub.1<about 50 wtppm. On an imaginary central axis line, a Cl concentration C.sub.2 in a central portion of the electrode facing portion and a Cl concentration C.sub.3 in both end portions of the electrode facing portion satisfy about 0.5C.sub.2≤C.sub.3<C.sub.2.

Manufacturing system, process, article, and furnace

A manufacturing system includes a tape advancing through the manufacturing system and a station of the manufacturing system. The tape includes a first portion having grains of an inorganic material bound by an organic binder. The station of the manufacturing system receives the first portion of the tape and prepares the tape for sintering by chemically changing the organic binder and/or removing the organic binder from the first portion of the tape, leaving the grains of the inorganic material, to form a second portion of the tape and, at least in part, prepare the tape for sintering.

Manufacturing system, process, article, and furnace

A manufacturing system includes a tape advancing through the manufacturing system and a station of the manufacturing system. The tape includes a first portion having grains of an inorganic material bound by an organic binder. The station of the manufacturing system receives the first portion of the tape and prepares the tape for sintering by chemically changing the organic binder and/or removing the organic binder from the first portion of the tape, leaving the grains of the inorganic material, to form a second portion of the tape and, at least in part, prepare the tape for sintering.

Manganese-zinc Ferrite with High Magnetic Permeability at Negative Temperature and Low Loss at High Temperature and Method for Preparing Same
20230042168 · 2023-02-09 · ·

A manganese-zinc ferrite with a high magnetic permeability at negative temperature and low loss at high temperature consists of Fe.sub.2O.sub.3, MnO and ZnO, and additives consisting of CaCO.sub.3, ZrO.sub.2, Co.sub.2O.sub.3 and SnO.sub.2 are also added. A method for preparing the manganese-zinc ferrite is further provided. According to the method, by reasonably adjusting a ratio of Mn to Zn to Fe and appropriately increasing the content of Co in the additives, a manganese-zinc ferrite material with both a high magnetic permeability and low loss at about −20° C. and low loss at 120-140° C. is obtained. The manganese-zinc ferrite material has two loss valleys at about −20° C. and about 100° C. in a temperature range of −30° C. to 140° C., which expands the application range of the manganese-zinc ferrite material.

Manganese-zinc Ferrite with High Magnetic Permeability at Negative Temperature and Low Loss at High Temperature and Method for Preparing Same
20230042168 · 2023-02-09 · ·

A manganese-zinc ferrite with a high magnetic permeability at negative temperature and low loss at high temperature consists of Fe.sub.2O.sub.3, MnO and ZnO, and additives consisting of CaCO.sub.3, ZrO.sub.2, Co.sub.2O.sub.3 and SnO.sub.2 are also added. A method for preparing the manganese-zinc ferrite is further provided. According to the method, by reasonably adjusting a ratio of Mn to Zn to Fe and appropriately increasing the content of Co in the additives, a manganese-zinc ferrite material with both a high magnetic permeability and low loss at about −20° C. and low loss at 120-140° C. is obtained. The manganese-zinc ferrite material has two loss valleys at about −20° C. and about 100° C. in a temperature range of −30° C. to 140° C., which expands the application range of the manganese-zinc ferrite material.