Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

The present invention relates to a laminated member, including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer containing a resin and lying on the glass member; and a Si—SiC member lying on the bonding layer, in which the glass member includes predetermined amounts of SiO.sub.2, Al.sub.2O.sub.3, B.sub.2O.sub.3, and P.sub.2O.sub.5, the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C., and has an average linear expansion coefficient β at 20 to 200° C. of 1.50 to 5.00 ppm/° C., and the laminated member has an absolute value |α−β|, which is a value obtained by subtracting β from α, of 2.00 ppm/° C. or less.

The present invention relates to a laminated member, including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer containing a resin and lying on the glass member; and a Si—SiC member lying on the bonding layer, in which the glass member includes predetermined amounts of SiO.sub.2, Al.sub.2O.sub.3, B.sub.2O.sub.3, and P.sub.2O.sub.5, the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C., and has an average linear expansion coefficient β at 20 to 200° C. of 1.50 to 5.00 ppm/° C., and the laminated member has an absolute value |α−β|, which is a value obtained by subtracting β from α, of 2.00 ppm/° C. or less.

Materials that seamlessly transition from opaque to transparent or translucent, such as advanced geopolymer-based ceramics to glass structures, which can be directly and seamlessly bonded without the use of an intermediate adhesive or use of a frame are disclosed. That is, a GP-based ceramic to glass structure can be bonded directly and seamlessly and without any mechanical joints, connective tissue or adhesives such as caulking or epoxy. Such ceramic to glass materials can be prepared by sintering an engineered geopolymer with glass to form the geopolymer-based advanced ceramic-glass structure in which the interface is visually abruptly or in which the material is a graded composition with a controlled transition from one material to the other.

The present disclosure provides a mirror device comprising a reflector plate having a rear face and a reflective front face, and a core attached to the rear surface of the reflector plate. The core comprises a first plate and a second plate, the first plate being stacked on the second plate, wherein the first plate and second plate are each monolithic and comprise a glass or ceramic. The mirror device further comprises a plurality of first holes formed in the first plate, each first hole formed through the entire thickness of the first plate, and a plurality of second holes formed in the second plate, each second hole formed through the entire thickness of the second plate, where a mean width of the first holes is less than a mean width of the second holes.

Provided are a manufacturing method for a composite wafer and a composite wafer obtained by using the manufacturing method, the manufacturing method including: preparing a first substrate in which a first layer of any one of oxides, oxynitrides, and nitrides is disposed on one surface; preparing a second substrate in which a second layer of any one of oxides, oxynitrides, and nitrides is disposed on one surface; forming a silicon layer on a surface of one of the first layer or the second layer; activating, with plasma, a surface of at least one of the silicon layer or another of the first layer or the second layer; and bonding the first substrate and the second substrate.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.