C04B41/4517

METHOD FOR MAKING A PASSIVATING COATING BASED ON ONE OR MORE SILICON COMPOUNDS ON A CERAMIC MATRIX COMPOSITE REINFORCED WITH CARBON FIBRES AND CERAMIC MATRIX COMPOSITE REINFORCED WITH CARBON FIBRES WITH SUCH COATING

A method makes a silicon compound-based passivating coating on a ceramic matrix composite reinforced with carbon fibers. A piece made in a ceramic matrix composite reinforced with carbon fibers is placed in a closed chamber of an oven. A predefined load of solid silicon is placed in the chamber avoiding direct contact between the silicon and the piece. The oven is heated while maintaining inside the chamber predefined medium/low vacuum conditions, to generate silicon vapors inside the chamber. The vapors react with substances on the surface of the piece to form a surface coating having composites of the substances with the silicon. The partial pressure of the vacuum, temperature inside the chamber and exposure times of the piece to the silicon vapors to obtain a predefined thickness of the surface coating are chosen. The piece is cooled once the predefined thickness of the passivating coating is reached.

METHOD FOR PRODUCING METAL MATRIX COMPOSITE AND METHOD FOR PREPARING PREFORM
20230234894 · 2023-07-27 ·

The present invention relates to a technique of dramatically improving a method for causing a molten metal of an Al alloy or the like to infiltrate without pressurization into a preform obtained by molding and hardening a ceramic powder, and obtaining “a metal matrix composite formed from a ceramic powder and an Al alloy or the like” in a uniform state as a whole more simply and stably, and the present invention provides “a production method for producing a metal matrix composite containing aluminum and ceramic, the method including: obtaining a mixed body by performing molding using a mixture containing a magnesium-containing powder, a ceramic powder, and an inorganic or organic/inorganic binder that is hardened when heated to 500° C. or lower; preparing a preform by calcining the mixed body at a temperature of 500° C. or lower; and causing an Al alloy or the like to infiltrate without pressurization into the obtained preform to produce the metal matrix composite containing aluminum and ceramic, and a method for preparing the preform.”

METHOD FOR PRODUCING METAL MATRIX COMPOSITE AND METHOD FOR PREPARING PREFORM
20230234894 · 2023-07-27 ·

The present invention relates to a technique of dramatically improving a method for causing a molten metal of an Al alloy or the like to infiltrate without pressurization into a preform obtained by molding and hardening a ceramic powder, and obtaining “a metal matrix composite formed from a ceramic powder and an Al alloy or the like” in a uniform state as a whole more simply and stably, and the present invention provides “a production method for producing a metal matrix composite containing aluminum and ceramic, the method including: obtaining a mixed body by performing molding using a mixture containing a magnesium-containing powder, a ceramic powder, and an inorganic or organic/inorganic binder that is hardened when heated to 500° C. or lower; preparing a preform by calcining the mixed body at a temperature of 500° C. or lower; and causing an Al alloy or the like to infiltrate without pressurization into the obtained preform to produce the metal matrix composite containing aluminum and ceramic, and a method for preparing the preform.”

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME

A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME

A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

FOAMED MATERIAL INFILTRATED WITH HIGH TEMPERATURE CERAMIC
20230150890 · 2023-05-18 ·

An open cell reticulated foam structure having a MAX phase ceramic material infiltrated at least partially into the foam structure to produce the infiltrated product. The open cell reticulated foam structure can be shaped and sized to the final shape and size of the final product prior to infiltrating with the MAX phase ceramic material. Sintering of the MAX phase ceramic material can be done with pressureless sintering. The final infiltrated product can provide heat shielding to temperatures in excess of 2400° C.

FOAMED MATERIAL INFILTRATED WITH HIGH TEMPERATURE CERAMIC
20230150890 · 2023-05-18 ·

An open cell reticulated foam structure having a MAX phase ceramic material infiltrated at least partially into the foam structure to produce the infiltrated product. The open cell reticulated foam structure can be shaped and sized to the final shape and size of the final product prior to infiltrating with the MAX phase ceramic material. Sintering of the MAX phase ceramic material can be done with pressureless sintering. The final infiltrated product can provide heat shielding to temperatures in excess of 2400° C.

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
20220032580 · 2022-02-03 · ·

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
20220032580 · 2022-02-03 · ·

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

Corrosion-resistant member

A corrosion-resistant member according to the present disclosure includes a substrate that is composed of an aluminum-oxide-based ceramic and a covering layer that is composed of an O—Al—C layer that is located on the substrate.