C04B41/4527

MULTI-ENVIRONMENTAL BARRIER COATING, PROCESSES FOR COATING ARTICLES, AND THEIR COATED ARTICLES

A coated article including an article having a surface; an oxidation resistant bond coat layer deposited on the surface, the oxidation resistant bond coat layer comprising a metal silicide phase, a crystalline ceramic phase and an amorphous ceramic phase, wherein the metal silicide phase has an aspect ratio greater than 1:1 but less than 50:1.

MULTI-ENVIRONMENTAL BARRIER COATING, PROCESSES FOR COATING ARTICLES, AND THEIR COATED ARTICLES

A coated article including an article having a surface; an oxidation resistant bond coat layer deposited on the surface, the oxidation resistant bond coat layer comprising a metal silicide phase, a crystalline ceramic phase and an amorphous ceramic phase, wherein the metal silicide phase has an aspect ratio greater than 1:1 but less than 50:1.

CMAS-RESISTANT ENVIRONMENTAL BARRIER AND THERMAL BARRIER COATINGS
20230002288 · 2023-01-05 ·

In some examples, an article for a high-temperature mechanical system including a substrate and a doped calcia-magnesia-alumina-silicate resistant (doped CMAS-resistant) layer on the substrate. The doped CMAS-resistant layer is a thermal barrier coating or an environmental barrier coating and includes a calcia dopant.

CMAS-RESISTANT ENVIRONMENTAL BARRIER AND THERMAL BARRIER COATINGS
20230002288 · 2023-01-05 ·

In some examples, an article for a high-temperature mechanical system including a substrate and a doped calcia-magnesia-alumina-silicate resistant (doped CMAS-resistant) layer on the substrate. The doped CMAS-resistant layer is a thermal barrier coating or an environmental barrier coating and includes a calcia dopant.

Post deposition heat treatment of coating on ceramic or ceramic matrix composite substrate

In one example, a method for forming an environmental barrier coating (EBC) and/or abradable coating on a substrate. The method may include depositing a coating on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited coating, wherein the coating includes at least one of an environmental barrier coating (EBC) and an abradable coating. The method further comprises heat treating the as-deposited coating at or above a first temperature for a first period of time following the deposition of the as-deposited coating on the substrate, wherein heat treating the as-deposited coating includes heating the as-deposited coating to or above the first temperature at a controlled rate. The heat treatment may be configured to at least one of decrease the open pores and/or microcracks of the heat-treated coating compared to the as-deposited coating or control a grain size of the heat-treated coating.

Post deposition heat treatment of coating on ceramic or ceramic matrix composite substrate

In one example, a method for forming an environmental barrier coating (EBC) and/or abradable coating on a substrate. The method may include depositing a coating on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited coating, wherein the coating includes at least one of an environmental barrier coating (EBC) and an abradable coating. The method further comprises heat treating the as-deposited coating at or above a first temperature for a first period of time following the deposition of the as-deposited coating on the substrate, wherein heat treating the as-deposited coating includes heating the as-deposited coating to or above the first temperature at a controlled rate. The heat treatment may be configured to at least one of decrease the open pores and/or microcracks of the heat-treated coating compared to the as-deposited coating or control a grain size of the heat-treated coating.

MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR SEMICONDUCTOR PROCESSING CHAMBER
20230223240 · 2023-07-13 ·

A component for use in a semiconductor processing chamber is provided. A component body of a dielectric material has a semiconductor processing facing surface. A coating of a dielectric material is on at least the semiconductor processing facing surface, wherein the dielectric material of the component body has a same stoichiometry as the dielectric material of the coating.

MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR SEMICONDUCTOR PROCESSING CHAMBER
20230223240 · 2023-07-13 ·

A component for use in a semiconductor processing chamber is provided. A component body of a dielectric material has a semiconductor processing facing surface. A coating of a dielectric material is on at least the semiconductor processing facing surface, wherein the dielectric material of the component body has a same stoichiometry as the dielectric material of the coating.

Article for high temperature service

An article for high temperature service is presented herein. One embodiment is an article including a substrate having a silicon-bearing ceramic matrix composite; and a layer disposed over the substrate, wherein the layer includes silicon and a dopant, the dopant including aluminum. In another embodiment, the article includes a ceramic matrix composite substrate, wherein the composite includes a silicon-bearing ceramic and a dopant, the dopant including aluminum; a bond coat disposed over the substrate, where the bond coat includes elemental silicon, a silicon alloy, a silicide, or combinations including any of the aforementioned; and a coating disposed over the bond coat, the coating including a silicate (such as an aluminosilicate or rare earth silicate), yttria-stabilized zirconia, or a combination including any of the aforementioned.

Article for high temperature service

An article for high temperature service is presented herein. One embodiment is an article including a substrate having a silicon-bearing ceramic matrix composite; and a layer disposed over the substrate, wherein the layer includes silicon and a dopant, the dopant including aluminum. In another embodiment, the article includes a ceramic matrix composite substrate, wherein the composite includes a silicon-bearing ceramic and a dopant, the dopant including aluminum; a bond coat disposed over the substrate, where the bond coat includes elemental silicon, a silicon alloy, a silicide, or combinations including any of the aforementioned; and a coating disposed over the bond coat, the coating including a silicate (such as an aluminosilicate or rare earth silicate), yttria-stabilized zirconia, or a combination including any of the aforementioned.