The present invention relates to a technique of dramatically improving a method for causing a molten metal of an Al alloy or the like to infiltrate without pressurization into a preform obtained by molding and hardening a ceramic powder, and obtaining “a metal matrix composite formed from a ceramic powder and an Al alloy or the like” in a uniform state as a whole more simply and stably, and the present invention provides “a production method for producing a metal matrix composite containing aluminum and ceramic, the method including: obtaining a mixed body by performing molding using a mixture containing a magnesium-containing powder, a ceramic powder, and an inorganic or organic/inorganic binder that is hardened when heated to 500° C. or lower; preparing a preform by calcining the mixed body at a temperature of 500° C. or lower; and causing an Al alloy or the like to infiltrate without pressurization into the obtained preform to produce the metal matrix composite containing aluminum and ceramic, and a method for preparing the preform.”

A composite fiber composed of at least a metal sintered body and a ceramic sintered body. In the composite fiber, the metal sintered body and the ceramic sintered body are adjacent to each other. The composite fiber having the metal sintered body and the ceramic sintered body can have a tensile strength of 5 kgf/mm.sup.2 or more.

A composite fiber composed of at least a metal sintered body and a ceramic sintered body. In the composite fiber, the metal sintered body and the ceramic sintered body are adjacent to each other. The composite fiber having the metal sintered body and the ceramic sintered body can have a tensile strength of 5 kgf/mm.sup.2 or more.

A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

An embodiment of a PCD insert comprises an embodiment of a PCD element joined to a cemented carbide substrate at an interface. The PCD element has internal diamond surfaces defining interstices between them. The PCD element comprises a masked or passivated region and an unmasked or unpassivated region, the unmasked or unpassivated region defining a boundary with the substrate, the boundary being the interface. At least some of the internal diamond surfaces of the masked or passivated region contact a mask or passivation medium, and some or all of the interstices of the masked or passivated region and of the unmasked or unpassivated region are at least partially filled with an infiltrant material.

An embodiment of a PCD insert comprises an embodiment of a PCD element joined to a cemented carbide substrate at an interface. The PCD element has internal diamond surfaces defining interstices between them. The PCD element comprises a masked or passivated region and an unmasked or unpassivated region, the unmasked or unpassivated region defining a boundary with the substrate, the boundary being the interface. At least some of the internal diamond surfaces of the masked or passivated region contact a mask or passivation medium, and some or all of the interstices of the masked or passivated region and of the unmasked or unpassivated region are at least partially filled with an infiltrant material.

A mould for manufacturing a packing member from a liquid ceramic composition. The mould including a first part and a second part, in which the first and/or second mould parts are resiliently deformable and the first part and/or the second part include a plurality of open mould cavities. The first and second parts are operable to engage to form closed mould cavities, and the mould is operable to be moved from an open position in which the first and second parts are partially spaced by the deformation of a mould part and in which position mould cavities are open, to a partially closed position by reducing the deformation of the mould part and in which position some of the mould cavities are closed, and then to a closed position by further reducing the deformation of the mould part and in which position the first and second parts are engaged such that the mould cavities are closed.

The invention is a method for treating a solid substrate, made from a first material, of metal or ceramic type, the method comprising placing the substrate in contact with a liquid metal, while the substrate is exposed to an ultrasonic wave called a power wave. At the level of a surface of the substrate, the power density is greater than a cavitation threshold of the liquid metal. Such exposure improves the wettability of the substrate surface by the liquid metal.

The invention is a method for treating a solid substrate, made from a first material, of metal or ceramic type, the method comprising placing the substrate in contact with a liquid metal, while the substrate is exposed to an ultrasonic wave called a power wave. At the level of a surface of the substrate, the power density is greater than a cavitation threshold of the liquid metal. Such exposure improves the wettability of the substrate surface by the liquid metal.