Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

A fluorene-containing compound having a formula (I) ##STR00001## where X and R are as defined in as defined in the specification.

A fluorene-containing compound having a formula (I)

##STR00001## where X and R are as defined in as defined in the specification.

Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). ##STR00001##
(In the formula, R.sup.1 represents an alkyl group, an alkoxy group, or an aryl group, R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R.sup.1's may be the same as or different from each other.)

Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). ##STR00001##
(In the formula, R.sup.1 represents an alkyl group, an alkoxy group, or an aryl group, R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R.sup.1's may be the same as or different from each other.)

Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film.

A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1).

##STR00001##

(In the formula, R.sup.1 represents an alkyl group, an alkoxy group, or an aryl group, R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R.sup.1's may be the same as or different from each other.)

Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film.

A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1).

##STR00001##

(In the formula, R.sup.1 represents an alkyl group, an alkoxy group, or an aryl group, R.sup.2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R.sup.1's may be the same as or different from each other.)