C08F12/12

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20230091645 · 2023-03-23 ·

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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Resin composition and article made therefrom

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

Ethylene-Based Interpolymers and Composition Comprising the Same
20170369609 · 2017-12-28 ·

A first ethylene-based interpolymer comprising, in polymerized form, monomer units derived from ethylene and from a benzocyclobutene (VBCB) structure of Structure 1; wherein n is from 3 to 10; and wherein the ethylene-based polymer comprises, in polymerized form, from 0.02 to 0.70 wt % of the Structure 1, based on the weight of the first ethylene-based interpolymer, as determined by .sup.1H NMR is provided. Further provided is a composition which comprises a second ethylene-based inter-polymer formed by thermally treating a first ethylene-based interpolymer.

PATTERNED POLYMERS AND DIRECTED POLYMER GROWTH BY INTIATED CHEMICAL VAPOR DEPOSITION

A method of forming a patterned polymer layer on a substrate and a substrate having a polymer layer formed by the method. The method includes providing a substrate comprising a first surface having a first surface energy and a pattern located on the substrate forming a second surface having a second, lower surface energy than the first surface, and selectively depositing a polymeric layer onto the first surface using a monomer material in an initiated chemical vapor deposition process, wherein the initiated chemical vapor deposition process is operated under supersaturation conditions during the deposition process.

CNSL-based hydrocarbon resins, preparation and uses thereof

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

CNSL-based hydrocarbon resins, preparation and uses thereof

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

Amphiphilic macromolecule and use thereof

Amphiphilic macromolecules having repeating structural units: structural units to adjust molecular weight and molecular weight distribution and charging property effects, high stereo-hindrance structural units, and amphiphilic structural units, which are suitable for fields such as oil field well drilling, well cementation, fracturing, oil gathering and transfer, sewage treatment, sludge treatment and papermaking, etc., and can be used as an oil-displacing agent for enhanced oil production, a heavy oil viscosity reducer, a fracturing fluid, a clay stabilizing agent, a sewage treatment agent, a papermaking retention and drainage aid or a reinforcing agent, etc.

HYDROCARBON RESIN POLYMER, PREPARATION METHOD THEREOF, AND COMPOSITION AND SUBSTRATE COMPRISING THE SAME

A hydrocarbon resin polymer is provided. The hydrocarbon resin polymer includes: 0.15-15 mol % of repeating units (A), which are derived from bridged ring monomer compounds; 15-90 mol % of repeating units (B), which are derived from monovinyl aromatic compounds; and 8-80 mol % of repeating units (C), which are derived from divinyl aromatic compounds.

HYDROCARBON RESIN POLYMER, PREPARATION METHOD THEREOF, AND COMPOSITION AND SUBSTRATE COMPRISING THE SAME

A hydrocarbon resin polymer is provided. The hydrocarbon resin polymer includes: 0.15-15 mol % of repeating units (A), which are derived from bridged ring monomer compounds; 15-90 mol % of repeating units (B), which are derived from monovinyl aromatic compounds; and 8-80 mol % of repeating units (C), which are derived from divinyl aromatic compounds.

POLYMERIC RESIN FOR DIELECTRIC APPLICATIONS
20230348635 · 2023-11-02 ·

There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.