The present specification relates to a polymer including a unit represented by Chemical Formula 1, a coating composition including the same, and an organic light emitting device formed using the same: ##STR00001##
wherein all the variables are described herein.

The present specification relates to a polymer including a unit represented by Chemical Formula 1, a coating composition including the same, and an organic light emitting device formed using the same: ##STR00001##
wherein all the variables are described herein.

A fluorescent water treatment polymer comprises at least one water soluble carboxylic acid monomer other than maleic acid, at least one sulfonated pyrene-containing fluorescent monomer, and at least one phosphino group wherein the phosphorous atom of the phosphino group is in the polymer backbone. Additional monomers can be present, with the proviso that if maleic acid is present it comprises no greater than 75 mol % of the polymer. Surprisingly, it has been found that when the phosphino group is present the polymers exhibit an unexpectedly strong fluorescent signal strength. The signal strength of the fluorescent monomer in the polymer is further enhanced when the polymer comprises no greater than 75 mol % maleic acid.

A fluorescent water treatment polymer comprises at least one water soluble carboxylic acid monomer other than maleic acid, at least one sulfonated pyrene-containing fluorescent monomer, and at least one phosphino group wherein the phosphorous atom of the phosphino group is in the polymer backbone. Additional monomers can be present, with the proviso that if maleic acid is present it comprises no greater than 75 mol % of the polymer. Surprisingly, it has been found that when the phosphino group is present the polymers exhibit an unexpectedly strong fluorescent signal strength. The signal strength of the fluorescent monomer in the polymer is further enhanced when the polymer comprises no greater than 75 mol % maleic acid.

The present disclosure relates to redox active materials, such as the compound of formula (I), comprising at least one 2,5-dithio-7-azabicyclo(2.2.1)heptane unit connected to a surface thereof, as well as processes for making said redox active materials. The present disclosure relates to a method for recovering a metal, comprising reacting a metal in oxidized state with said redox active material. The present disclosure relates to uses of these redox active materials in sensors, electronic materials and for extracting metals.

The present specification relates to a polymer comprising a unit represented by Chemical Formula 1, a monomer represented by Chemical Formula 2, a coating composition comprising the same, an organic light emitting device formed using the same, and a method for manufacturing an organic light emitting device using the same:

##STR00001##

wherein the variables are described herein.

The present specification relates to a polymer comprising a unit represented by Chemical Formula 1, a monomer represented by Chemical Formula 2, a coating composition comprising the same, an organic light emitting device formed using the same, and a method for manufacturing an organic light emitting device using the same:

##STR00001##

wherein the variables are described herein.

The present specification relates to a fluorene-based compound of Chemical Formula 1, a coating composition including the fluorene-based compound of Chemical Formula 1, an organic light emitting device using the same, and a manufacturing method thereof

##STR00001##

wherein X1 to X4, L1, L2, R1 to R6, Ar1, Ar2, m1, m2, and n1 to n6 are described herein.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##