Patent classifications
C08F12/34
COMPOUND, MIXTURE, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING COMPOUND
A compound of formula 1:
##STR00001##
where X and Y are each a different optional organic group. When there is a plurality of X, each X in the plurality of X may be the same as or different from each other. When there is a plurality of Y, each Y in the plurality of Y may be the same as or different from each other. R represents a hydrocarbon group having 1 to 10 carbon atoms or a halogenated alkyl group. When there is a plurality of R, each R in the plurality of R may be the same as or different from each other. Variable m is an integer of 0 to 3, n is a repeating unit and satisfies 1≤n≤20, and p is a repeating unit and satisfies 0≤p≤20.
Fluorene-Based Compound, Organic Light-Emitting Device Using Same, And Manufacturing Method Therefor
The present specification relates to a fluorene-based compound of Chemical Formula 1, a coating composition including the fluorene-based compound of Chemical Formula 1, an organic light emitting device using the same, and a manufacturing method thereof
##STR00001##
wherein X1 to X4, L1, L2, R1 to R6, Ar1, Ar2, m1, m2, and n1 to n6 are described herein.
POSITIVE RESIST MATERIAL AND PATTERNING PROCESS
A positive resist material contains an acid generator, and a base polymer containing a repeating unit having two carboxyl groups whose hydrogen atoms are substituted with two tertiary carbon atoms each bonded to a double bond or triple bond. The repeating unit having two carboxyl groups whose hydrogen atoms are substituted with two tertiary carbon atoms each bonded to a double bond or triple bond is represented by a repeating unit-a in the following formula (1). Thus, the present invention provides: a positive resist material having higher sensitivity than conventional positive resist materials and smaller dimensional variation; and a patterning process.
##STR00001##
Prepolymerized resin, preparation method thereof, resin composition comprising the same, and article made therefrom
A prepolymerized resin prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor. The composition at least includes bis(vinylphenyl)ethane and polybutadiene. The polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%. During the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups. The composition further includes vinyl-containing polyphenylene ether and has a number average molecular weight of between 4,000 and 12,000.
Prepolymerized resin, preparation method thereof, resin composition comprising the same, and article made therefrom
A prepolymerized resin prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor. The composition at least includes bis(vinylphenyl)ethane and polybutadiene. The polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%. During the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups. The composition further includes vinyl-containing polyphenylene ether and has a number average molecular weight of between 4,000 and 12,000.
POLYMERIC MATERIALS FOR CAPTURING FORMALDEHYDE
Sorbent polymeric material suitable for capturing formaldehyde, polymeric material resulting from the capture of formaldehyde by the sorbent polymeric material, and methods for capturing formaldehyde are provided. The sorbent polymeric material has multiple aromatic rings and can be formed by initially preparing a precursor polymeric material from a polymerizable composition that contains a free-radically polymerizable spirobisindane monomer. The precursor polymeric material is subsequently treated with a sulfonyl-containing compound to form groups of formula —SO.sub.2R.sup.5 where each R.sup.5 is independently —NH.sub.2 or —NR.sup.6-Q-NR.sup.6R.sup.7. Each R.sup.6 is hydrogen or an alkyl. Each R.sup.7 is hydrogen or —C(═NH)—NH.sub.2. Each Q is a single bond, alkylene, or a group of formula -(Q.sup.1-NR.sup.6).sub.x-Q.sup.2- where each Q.sup.1 is an alkylene, each Q.sup.2 is an alkylene, and x is in an integer in a range of 1 to 4.
Resin, resist composition and method for producing resist pattern
Disclosed is a resin comprising a structural unit derived from a compound represented by formula (I′) and a structural unit having an acid-labile group: ##STR00001## ##STR00002##
wherein R.sup.1 and R.sup.2 each independently represent an alkyl group which may have a halogen atom, a hydrogen atom or a halogen atom,
Ar represents an aromatic hydrocarbon group which may have a substituent,
L.sup.1 represents a group represented by formula (X.sup.1-1), etc.,
L.sup.11, L.sup.13, L.sup.15 and L.sup.17 each independently represent an alkanediyl group,
L.sup.12, L.sup.14, L.sup.16 and L.sup.18 each independently represent —O—, —CO—, —CO—O—, —O—CO— or —O—CO—O—, and
* and ** are bonds, and ** represents a bond to an iodine atom.
Resin, resist composition and method for producing resist pattern
Disclosed is a resin comprising a structural unit derived from a compound represented by formula (I′) and a structural unit having an acid-labile group: ##STR00001## ##STR00002##
wherein R.sup.1 and R.sup.2 each independently represent an alkyl group which may have a halogen atom, a hydrogen atom or a halogen atom,
Ar represents an aromatic hydrocarbon group which may have a substituent,
L.sup.1 represents a group represented by formula (X.sup.1-1), etc.,
L.sup.11, L.sup.13, L.sup.15 and L.sup.17 each independently represent an alkanediyl group,
L.sup.12, L.sup.14, L.sup.16 and L.sup.18 each independently represent —O—, —CO—, —CO—O—, —O—CO— or —O—CO—O—, and
* and ** are bonds, and ** represents a bond to an iodine atom.
Curable composition and cured polymer product
Provided are a curable composition including a compound expressed by General Formula (1) below; a polymerization initiator; and a chain transfer agent, and a cured polymer product. ##STR00001##
In General Formula (1), m represents an integer of 1 to 4, and n represents an integer of 1 to 4. Here, a sum of m and n is not greater than 5. M.sup.A represents a hydrogen ion, an inorganic ion, or an organic ion. Here, an inorganic ion and an organic ion may be bivalent or higher ions. Each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or an alkyl group.
Curable composition and cured polymer product
Provided are a curable composition including a compound expressed by General Formula (1) below; a polymerization initiator; and a chain transfer agent, and a cured polymer product. ##STR00001##
In General Formula (1), m represents an integer of 1 to 4, and n represents an integer of 1 to 4. Here, a sum of m and n is not greater than 5. M.sup.A represents a hydrogen ion, an inorganic ion, or an organic ion. Here, an inorganic ion and an organic ion may be bivalent or higher ions. Each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or an alkyl group.