C08F16/20

Polymer, monomer, resist composition, and patterning process

A pattern forming process is provided comprising the steps of applying a resist composition comprising a polymer comprising recurring units having formula (1a) and/or (1b), an acid generator and a solvent onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing in an alkaline developer to form a negative tone pattern.

Polyvinyl esters and methods related thereto

Disclosed herein are isotactic polyvinyl ethers and improved methods of making same. The method disclosed herein can produce polyvinyl ethers having a higher isotacticity as compared to polyvinyl ethers prepared with conventional methods.

Polyvinyl esters and methods related thereto

Disclosed herein are isotactic polyvinyl ethers and improved methods of making same. The method disclosed herein can produce polyvinyl ethers having a higher isotacticity as compared to polyvinyl ethers prepared with conventional methods.

POLYVINYL ESTERS AND METHODS RELATED THERETO
20210324121 · 2021-10-21 ·

Disclosed herein are isotactic polyvinyl ethers and improved methods of making same. The method disclosed herein can produce polyvinyl ethers having a higher isotacticity as compared to polyvinyl ethers prepared with conventional methods.

Particles, connecting material and connection structure

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.

Particles, connecting material and connection structure

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.

POLYMER FILM, AND OPTICAL MEMBER, POLARIZING MEMBER, AND DISPLAY DEVICE EMPLOYING SAME

Provided are: a polymer film of which film strength is difficult to be degraded and which has a lower reflectance, even when an additive is used, and an optical member, a polarizing member, and a display device employing the same. A low refractive index layer (the polymer film 13) includes a binder 132 including a product obtained by photopolymerizing a mixture of a side-chain-reactive photopolymerizable fluoropolymer and a siloxane compound. Further, the low refractive index layer 13 includes hollow silica particles 131 distributed in the binder 132. Further, the low refractive index layer 13 includes a product obtained by photopolymerizing a one-end reactive-type photopolymerizable fluoropolymer, and a modified silicone, which are mainly distributed in a surface side.

POLYMER FILM, AND OPTICAL MEMBER, POLARIZING MEMBER, AND DISPLAY DEVICE EMPLOYING SAME

Provided are: a polymer film of which film strength is difficult to be degraded and which has a lower reflectance, even when an additive is used, and an optical member, a polarizing member, and a display device employing the same. A low refractive index layer (the polymer film 13) includes a binder 132 including a product obtained by photopolymerizing a mixture of a side-chain-reactive photopolymerizable fluoropolymer and a siloxane compound. Further, the low refractive index layer 13 includes hollow silica particles 131 distributed in the binder 132. Further, the low refractive index layer 13 includes a product obtained by photopolymerizing a one-end reactive-type photopolymerizable fluoropolymer, and a modified silicone, which are mainly distributed in a surface side.

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part, that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part, after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 nm or more and 15 m or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part, that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part, after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 nm or more and 15 m or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.