An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

The present invention relates to a process for polymerizing ethylene-1-butene copolymers in a solution polymerization process by firstly modelling polymer systems for solution polymerization of ethylene-1-butene copolymers and then transferring pressure and temperature conditions from said modelled polymer systems to a solution polymerization process to ensure that the polymerized ethylene-1-butene copolymer is completely solved in the solvent during the polymerization process.

The present invention relates to a process for polymerizing ethylene-1-butene copolymers in a solution polymerization process by firstly modelling polymer systems for solution polymerization of ethylene-1-butene copolymers and then transferring pressure and temperature conditions from said modelled polymer systems to a solution polymerization process to ensure that the polymerized ethylene-1-butene copolymer is completely solved in the solvent during the polymerization process.

The present invention relates to a process for polymerizing ethylene-1-octene copolymers in a solution polymerization process by firstly modelling polymer systems for solution polymerization of ethylene-1-octene copolymers and then transferring pressure and temperature conditions from said modelled polymer systems to a solution polymerization process to ensure that the polymerized ethylene-1-octene copolymer is completely solved in the solvent during the polymerization process.

The present invention relates to a process for polymerizing ethylene-1-octene copolymers in a solution polymerization process by firstly modelling polymer systems for solution polymerization of ethylene-1-octene copolymers and then transferring pressure and temperature conditions from said modelled polymer systems to a solution polymerization process to ensure that the polymerized ethylene-1-octene copolymer is completely solved in the solvent during the polymerization process.

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm.sup.3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm.sup.3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm.sup.3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.

A metal complex of the formula (1) TCyLMZ.sub.p (1), wherein M is a group 4 metal, Z is an anionic ligand, p is the number 1 or 2, TCy is a thiophene-fused cyclopentadienyl-type ligand of the formula (2) ##STR00001##
is described. Methods of making and using the metal complex are also described.