Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

Provided herein are processes for the generation of composite polymer materials utilizing a single resin. The processes utilize diffusion between a region undergoing a polymerization reaction preferentially polymerizing one monomer component and an unreactive region. Diffusion and subsequent/concurrent polymerization results in a higher concentration of the more reactive monomer component in the reacting region and a higher concentration of the less reactive monomer components in the unreactive region. The unreactive region may be later polymerized. In embodiments, photopolymerization is used and the regions are generated by a mask or other mechanism to pattern the light.

Provided herein are processes for the generation of composite polymer materials utilizing a single resin. The processes utilize diffusion between a region undergoing a polymerization reaction preferentially polymerizing one monomer component and an unreactive region. Diffusion and subsequent/concurrent polymerization results in a higher concentration of the more reactive monomer component in the reacting region and a higher concentration of the less reactive monomer components in the unreactive region. The unreactive region may be later polymerized. In embodiments, photopolymerization is used and the regions are generated by a mask or other mechanism to pattern the light.

Copolymers of one or more halogenated olefins and one or more halogenated co-monomers selected from the group consisting of halogenated alkenyl ethers, halogenated alkenyl esters, and halogenated (meth)acrylates are useful in various end-use applications wherein the presence of halogen (e.g., fluorine) in the copolymer imparts one or more desirable properties, as compared to analogous copolymers not containing halogen.

Copolymers of one or more halogenated olefins and one or more halogenated co-monomers selected from the group consisting of halogenated alkenyl ethers, halogenated alkenyl esters, and halogenated (meth)acrylates are useful in various end-use applications wherein the presence of halogen (e.g., fluorine) in the copolymer imparts one or more desirable properties, as compared to analogous copolymers not containing halogen.

A binder for a secondary battery includes a copolymer having a first repeating unit, a second repeating unit, and a third repeating unit. A ratio of a number of the first repeating unit (A) and a sum of a number of the second repeating unit and a number of the third repeating unit (B) is 90:10 to 52:48. A ratio of the number of the second repeating unit and the number of the third repeating unit is 67:33 to 1:99. A weight average molecular weight of the copolymer is 225,000 to 2,000,000.

The present invention is related to the use of ethylene alkanoate-alkyl acrylate bipolymers with a high randomness monomers distribution, which are synthesized by semicontinuous emulsion polymerization process, characterized because it is carried out using slow addition rate of the pre-emulsion feeding ({dot over (q)}≤0.009 kg.Math.L.sup.−1.Math.min.sup.−1), stabilized this last one by alkyl glycol ether type surfactants, at temperatures higher than 75° C. and with solids contents above 25 wt %, which avoids the formation of large sequences (blocks) of a same monomer. This structural characteristic gives the ethylene alkanoate-alkyl acrylate bipolymers a high efficiency as chemical agents for removal of complex water/crude oil emulsions of crude oil blends.

The present invention is related to the use of ethylene alkanoate-alkyl acrylate bipolymers with a high randomness monomers distribution, which are synthesized by semicontinuous emulsion polymerization process, characterized because it is carried out using slow addition rate of the pre-emulsion feeding ({dot over (q)}≤0.009 kg.Math.L.sup.−1.Math.min.sup.−1), stabilized this last one by alkyl glycol ether type surfactants, at temperatures higher than 75° C. and with solids contents above 25 wt %, which avoids the formation of large sequences (blocks) of a same monomer. This structural characteristic gives the ethylene alkanoate-alkyl acrylate bipolymers a high efficiency as chemical agents for removal of complex water/crude oil emulsions of crude oil blends.

A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m.sup.3 or more and 500 kg/m.sup.3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×10.sup.3 or more and 2×10.sup.5 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.

A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m.sup.3 or more and 500 kg/m.sup.3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×10.sup.3 or more and 2×10.sup.5 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.