A problem of the present invention is to provide a polymerizable compound and a polymerizable composition which cause little decrease in retardation and discoloration when a film-shaped polymer produced by polymerization is irradiated with ultraviolet/visible light for a long time at high temperature. A further problem is to provide a polymer produced by polymerizing the polymerizable composition and an optically anisotropic body using the polymer. As a result, a compound useful as a component of a polymerizable composition was obtained. An optically anisotropic body using a polymerizable liquid crystal composition containing the compound of the present invention is useful for application to an optical film and the like.

The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) ##STR00001##
RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.

Provided are (i) a solution for forming an organic semiconductor layer which solution has an excellent coating property, (ii) an organic semiconductor which is produced with use of the solution and which has high heat resistance, (iii) a layer which contains the organic semiconductor, and (iv) an organic thin film transistor which exhibits high electrical properties. A composition containing: an organic semiconductor; and a polymer (1) having at least one unit selected from the group consisting of units represented by formulae (1-a), (1-b), and (1-c). A composition containing the organic semiconductor, the polymer (1), and an organic solvent can be suitably used as a solution for forming an organic semiconductor layer.

Provided are (i) a solution for forming an organic semiconductor layer which solution has an excellent coating property, (ii) an organic semiconductor which is produced with use of the solution and which has high heat resistance, (iii) a layer which contains the organic semiconductor, and (iv) an organic thin film transistor which exhibits high electrical properties. A composition containing: an organic semiconductor; and a polymer (1) having at least one unit selected from the group consisting of units represented by formulae (1-a), (1-b), and (1-c). A composition containing the organic semiconductor, the polymer (1), and an organic solvent can be suitably used as a solution for forming an organic semiconductor layer.

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa.Math.s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa.Math.s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

The purpose of the present invention is to provide: a resin material that has a novel structure and can be suitably used in a printed wiring board: and a resin composition that contains this resin material and has a cured product thereof having a low dielectric loss tangent and excellent adhesion, heat resistance, and mechanical characteristics. The present invention provides: a polyamic acid resin that is a reaction product of an amino phenol compound (a), an aliphatic diamino compound (b), a tetrabasic acid dianhydride (c), and an aromatic diamino compound (d), said polyamic acid resin having an amino group at both ends thereof: a polyimide resin being an imidization compound of the polyamic acid resin: a resin composition containing the polyimide resin: and a cured product thereof.

A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R.sup.1 to R.sup.3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.