An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to A.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

##STR00001##

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to A.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

##STR00001##

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, ##STR00001## noting that in the general formula (1B), when W.sub.1 represents ##STR00002##  R.sub.1 does not represent any of ##STR00003##

A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.