The present invention aims to provide an adhesive composition that can exhibit excellent adhesion to both smooth surfaces and rough surfaces. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition, as well as a method for fixing and a method for producing an electronic device component or an in-vehicle component using the adhesive tape. Provided is an adhesive composition containing an acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate.

The present invention aims to provide an adhesive composition that can exhibit excellent adhesion to both smooth surfaces and rough surfaces. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition, as well as a method for fixing and a method for producing an electronic device component or an in-vehicle component using the adhesive tape. Provided is an adhesive composition containing an acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate.

The present invention provides a material for intraocular lens which has improved hydrolysis resistance. The material for intraocular lens according to the present invention is obtained by polymerizing a monomer composition comprising: a base monomer, a hydrophilic monomer, and a cross-likable monomer, wherein the base monomer comprises an aromatic ring-containing acrylate monomer and an alkoxyalkyl methacrylate monomer having an alkoxyalkyl group having four or less carbon atoms. A blending ratio on a molar basis of the methacrylate monomer with respect to the acrylate monomer in all the monomer components contained in the monomer composition is 0.25 to 1.00.

A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.

A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.

A pressure-sensitive adhesive comprising a polymer (X1) containing 48% by mass or more of a constituent unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by the following general formula (1) and a monomer (B1) represented by the following general formula (2), in which a tan δ (23° C.) determined as G″ (23° C.)/G′ (23° C.) is 0.8 to 1.3, wherein a storage elastic modulus and a loss coefficient at 23° C. are respectively represented by G′ (23° C.) and G″ (23° C.). In the formula (1), R.sup.1 represents H or CH.sub.3, R.sup.2 represents —C.sub.nH.sub.2n+1 and n represents an integer of 7 to 14. In the formula (2), R.sup.3 represents —C(═O)C.sub.mH.sub.2m+1 and m represents an integer of 7 to 13. Thus, retention force under high temperature, low-temperature attachability, and adhesiveness to a low-polar adherend are favorable along with a high bio rate.

A pressure-sensitive adhesive comprising a polymer (X1) containing 48% by mass or more of a constituent unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by the following general formula (1) and a monomer (B1) represented by the following general formula (2), in which a tan δ (23° C.) determined as G″ (23° C.)/G′ (23° C.) is 0.8 to 1.3, wherein a storage elastic modulus and a loss coefficient at 23° C. are respectively represented by G′ (23° C.) and G″ (23° C.). In the formula (1), R.sup.1 represents H or CH.sub.3, R.sup.2 represents —C.sub.nH.sub.2n+1 and n represents an integer of 7 to 14. In the formula (2), R.sup.3 represents —C(═O)C.sub.mH.sub.2m+1 and m represents an integer of 7 to 13. Thus, retention force under high temperature, low-temperature attachability, and adhesiveness to a low-polar adherend are favorable along with a high bio rate.

An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.

An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.

A pattern forming method includes: applying an actinic ray-sensitive or radiation- sensitive resin composition onto a substrate to form a resist film; forming an upper layer film on the resist film, using a composition for forming an upper layer film; exposing the resist film having the upper layer film formed thereon; and developing the exposed resist film using a developer including an organic solvent to form a pattern. The composition for forming an upper layer film contains a resin having a repeating unit (a) with a ClogP value of 2.85 or more and a compound (b) with a ClogP of 1.30 or less, and the receding contact angle of the upper layer film with water is 70 degrees or more, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method.