Patent classifications
C08F220/1812
UV cure basecoatings for medical devices
The invention concerns coating composition comprising hydrophobic polymer for use as a photoreactive basecoat for a medical device or implant comprising a polymer made from monomers comprising: (a) 1 to 12 mol % of at least one photoactive monomer that is a hydrogen atom abstracter and (b) 99 to 88 mol % of one or more of acrylamides, methacrylamides, acrylates, methacrylates, and N-vinylpyrrolidone; wherein the polymer has a glass transition temperature (Tg) of less than 40° C.
UV cure basecoatings for medical devices
The invention concerns coating composition comprising hydrophobic polymer for use as a photoreactive basecoat for a medical device or implant comprising a polymer made from monomers comprising: (a) 1 to 12 mol % of at least one photoactive monomer that is a hydrogen atom abstracter and (b) 99 to 88 mol % of one or more of acrylamides, methacrylamides, acrylates, methacrylates, and N-vinylpyrrolidone; wherein the polymer has a glass transition temperature (Tg) of less than 40° C.
RESIN COMPOSITION, MOLDED ARTICLE, MASTER BATCH, AND MANUFACTURING METHODS THEREFOR
The invention provides a thermoplastic resin composition, a molded article, and production methods therefor. The thermoplastic resin composition can sufficiently exhibit a cellulose addition effect and impart excellent mechanical strength to the molded article, particularly a foam molded article. More specifically, the invention provides a resin composition and a foam molded article thereof. The resin composition contains: a cellulose fiber (A); an amorphous resin (B) having a glass transition temperature of 160° C. or lower; a crystalline resin (C) having a melting point (melting peak temperature) of 80° C. to 150° C. and a melting start temperature lower than the melting point by 30° C. or more; and a thermoplastic resin (D) having a melting point or a glass transition temperature higher than the melting point of the crystalline resin (C) by 5° C. or more.
RESIN COMPOSITION, MOLDED ARTICLE, MASTER BATCH, AND MANUFACTURING METHODS THEREFOR
The invention provides a thermoplastic resin composition, a molded article, and production methods therefor. The thermoplastic resin composition can sufficiently exhibit a cellulose addition effect and impart excellent mechanical strength to the molded article, particularly a foam molded article. More specifically, the invention provides a resin composition and a foam molded article thereof. The resin composition contains: a cellulose fiber (A); an amorphous resin (B) having a glass transition temperature of 160° C. or lower; a crystalline resin (C) having a melting point (melting peak temperature) of 80° C. to 150° C. and a melting start temperature lower than the melting point by 30° C. or more; and a thermoplastic resin (D) having a melting point or a glass transition temperature higher than the melting point of the crystalline resin (C) by 5° C. or more.
PHOTOCURABLE COMPOSITION, CURED BODY, GASKET IN WHICH CURED BODY IS USED, WATERTIGHT STRUCTURE, AND METHOD FOR MANUFACTURING GASKET
A photocurable composition is provided. A cured product formed by curing the photocurable composition has reworkability and excellent heat resistance while having flexibility. The photocurable composition includes a telechelic acrylic polymer having an acryloyl group at both ends; a polyfunctional acrylic polymer having acryloyl groups; a monofunctional acrylic monomer; and a fumed silica including at least one of a hydrophilic fumed silica or a fumed silica having a polar group. The photocurable composition has a Martens hardness of 0.07 to 0.75 N/mm.sup.2, where the Martens hardness is a hardness after the photocurable composition is cured.
PHOTOCURABLE COMPOSITION, CURED BODY, GASKET IN WHICH CURED BODY IS USED, WATERTIGHT STRUCTURE, AND METHOD FOR MANUFACTURING GASKET
A photocurable composition is provided. A cured product formed by curing the photocurable composition has reworkability and excellent heat resistance while having flexibility. The photocurable composition includes a telechelic acrylic polymer having an acryloyl group at both ends; a polyfunctional acrylic polymer having acryloyl groups; a monofunctional acrylic monomer; and a fumed silica including at least one of a hydrophilic fumed silica or a fumed silica having a polar group. The photocurable composition has a Martens hardness of 0.07 to 0.75 N/mm.sup.2, where the Martens hardness is a hardness after the photocurable composition is cured.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.
Radiation-sensitive resin composition, method for forming pattern, and method for producing monomeric compound
A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R.sup.3 is an acid-dissociable group; and R.sup.41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of R.sup.f1 and R.sup.f2 is a fluorine atom or a fluoroalkyl group; R.sup.5a is a monovalent organic group having a cyclic structure; X.sub.1.sup.+ is a monovalent onium cation; R.sup.5b is a monovalent organic group, and X.sub.2.sup.+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure. ##STR00001##
Radiation-sensitive resin composition, method for forming pattern, and method for producing monomeric compound
A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R.sup.3 is an acid-dissociable group; and R.sup.41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of R.sup.f1 and R.sup.f2 is a fluorine atom or a fluoroalkyl group; R.sup.5a is a monovalent organic group having a cyclic structure; X.sub.1.sup.+ is a monovalent onium cation; R.sup.5b is a monovalent organic group, and X.sub.2.sup.+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure. ##STR00001##