C08F220/1818

URETHANE COMPOUND

A urethane compound (A) including units formed from (A1) an isocyanate and (A2) a long-chain alcohol represented by the formula HO—Z(Y—R).sub.n [wherein the R moieties are each independently —O—, —NH—, —O—C(═O)—, —NH—C(═O)—, —C(═O)—NH—, —O—C(═O)—NH—, —NH—C(═O)—O—, —NH—C(═O)—NH—, —NH—S(═O).sub.2—, —S(═O).sub.2—NH—, —NH—(CH.sub.2).sub.m—NH—S(═O).sub.2—, —NH—(CH.sub.2).sub.m—S(═O).sub.2—NH—, etc. (m is an integer of 1-5), Z is a direct bond or a di- or trivalent hydrocarbon group having 1-5 carbon atoms, and n is 1 or 2]. Also disclosed is a urethane mixture containing the urethane compound (A), and at least one selected from the polyisocyanate (A1), the long-chain alcohol (A2), a blocking agent (A3) and an alcohol compound (A4); an aqueous urethane composition; a method for producing the aqueous urethane composition; a method of treating a substrate; and a treated textile product.

URETHANE COMPOUND

A urethane compound (A) including units formed from (A1) an isocyanate and (A2) a long-chain alcohol represented by the formula HO—Z(Y—R).sub.n [wherein the R moieties are each independently —O—, —NH—, —O—C(═O)—, —NH—C(═O)—, —C(═O)—NH—, —O—C(═O)—NH—, —NH—C(═O)—O—, —NH—C(═O)—NH—, —NH—S(═O).sub.2—, —S(═O).sub.2—NH—, —NH—(CH.sub.2).sub.m—NH—S(═O).sub.2—, —NH—(CH.sub.2).sub.m—S(═O).sub.2—NH—, etc. (m is an integer of 1-5), Z is a direct bond or a di- or trivalent hydrocarbon group having 1-5 carbon atoms, and n is 1 or 2]. Also disclosed is a urethane mixture containing the urethane compound (A), and at least one selected from the polyisocyanate (A1), the long-chain alcohol (A2), a blocking agent (A3) and an alcohol compound (A4); an aqueous urethane composition; a method for producing the aqueous urethane composition; a method of treating a substrate; and a treated textile product.

WATER REPELLENT COMPOSITION, METHOD FOR PRODUCING WATER REPELLENT COMPOSITION, AND FIBER PRODUCT

A water repellent composition includes a polyurethane resin compound, a non-fluorine water repellent compound, a surfactant, and a liquid medium. The polyurethane resin compound includes at least one kind selected from the group consisting of a first polyurethane resin compound, a second polyurethane resin compound, and a third polyurethane resin compound:

WATER REPELLENT COMPOSITION, METHOD FOR PRODUCING WATER REPELLENT COMPOSITION, AND FIBER PRODUCT

A water repellent composition includes a polyurethane resin compound, a non-fluorine water repellent compound, a surfactant, and a liquid medium. The polyurethane resin compound includes at least one kind selected from the group consisting of a first polyurethane resin compound, a second polyurethane resin compound, and a third polyurethane resin compound:

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An actinic ray-sensitive or radiation-sensitive resin composition includes a salt including a sulfonium cation having an aryl group substituted with an acid-decomposable group-containing group and having at least three fluorine atoms; and a resin having a polarity that increases through decomposition by an action of an acid, in which the acid-decomposable group-containing group includes a group having a polarity that increases through decomposition by an action of an acid, and the acid-decomposable group-containing group includes no fluorine atom.

PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOSITION FOR FORMING UPPER LAYER FILM

A pattern forming method includes: applying an actinic ray-sensitive or radiation- sensitive resin composition onto a substrate to form a resist film; forming an upper layer film on the resist film, using a composition for forming an upper layer film; exposing the resist film having the upper layer film formed thereon; and developing the exposed resist film using a developer including an organic solvent to form a pattern. The composition for forming an upper layer film contains a resin having a repeating unit (a) with a ClogP value of 2.85 or more and a compound (b) with a ClogP of 1.30 or less, and the receding contact angle of the upper layer film with water is 70 degrees or more, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method.

PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOSITION FOR FORMING UPPER LAYER FILM

A pattern forming method includes: applying an actinic ray-sensitive or radiation- sensitive resin composition onto a substrate to form a resist film; forming an upper layer film on the resist film, using a composition for forming an upper layer film; exposing the resist film having the upper layer film formed thereon; and developing the exposed resist film using a developer including an organic solvent to form a pattern. The composition for forming an upper layer film contains a resin having a repeating unit (a) with a ClogP value of 2.85 or more and a compound (b) with a ClogP of 1.30 or less, and the receding contact angle of the upper layer film with water is 70 degrees or more, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method.

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

Nanofiber dispersion, method of producing nanofiber dispersion, powdery nanofibers obtainable from the dispersion, resin composition containing the powdery nanofibers ad molding material for 3D printer using the resin composition

The present application provides a dispersion dispersed satisfactorily cellulose nanofibers, powdery cellulose nanofibers obtained by pulverizing thereof, a resin composition obtained by blending thereof and a molding raw material for a 3D printer by using thereof. It is possible to obtain a composition uniformly finely dispersed the cellulose nanofibers by treating a mixture containing unmodified cellulose nanofibers and a dispersant using a high speed agitating Medialess disperser, and followed by pulverizing the composition to blend with a resin and a rubber component. Also, a resin composition improved in mechanical properties and heat resistance, obtained by blending the powdery cellulose nanofibers above with a thermoplastic resin or a thermosetting resin, is useful as a molding material for a 3D printer.