Patent classifications
C08F220/26
Low outgassing clean adhesive
Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.
Low outgassing clean adhesive
Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN MULTILAYER BODY
The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.
RESIST MATERIAL AND PATTERN FORMING METHOD
It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R.sup.1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R.sup.1 may be the same or different. R.sup.11 represents a hydrogen atom or an alkyl group optionally having a substituent. R.sup.2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y.sup.1 represents a single bond or a linking group.
##STR00001##
RESIST MATERIAL AND PATTERN FORMING METHOD
It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R.sup.1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R.sup.1 may be the same or different. R.sup.11 represents a hydrogen atom or an alkyl group optionally having a substituent. R.sup.2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y.sup.1 represents a single bond or a linking group.
##STR00001##
POWDERED DISPERSANT FOR HYDRAULIC COMPOSITIONS AND PRODUCTION METHOD THEREOF
The present invention is a powdered dispersant for hydraulic compositions containing a copolymer obtained by polymerizing raw material monomers containing a predetermined monomer 1 containing AO group with a number of added moles n falling within a predetermined range and a predetermined monomer 2 having a predetermined group such as a carboxylic acid group or the like, wherein a ratio of monomer 2 in the raw material monomers is 22 mass % or more, and a product of a value of n of monomer 1 and a value of mass % of the ratio is 420 or more and 2600 or less.
RESIN COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
Provided are a resin composition including a coloring material, a resin, and a solvent, in which the resin includes a resin having a structure represented by Formula (1); a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (1), Z.sup.1 represents an (m+n)-valent linking group, Y.sup.1 and Y.sup.2 each independently represent a single bond or a divalent linking group, A.sup.1 represents a group including a coloring material adsorption portion, P.sup.1 represents a polymer chain, n represents 1 to 20, m represents 1 to 20, and m+n represents 2 to 21, and in a case where m is 1, the polymer chain represented by P.sup.1 includes a repeating unit having an oxetane group, and in a case where m is 2 or more, at least one polymer chain of m pieces of polymer chains represented by P.sup.1 includes a repeating unit having an oxetane group.
[A.sup.1-Y.sup.1.sub.nZ.sup.1
Y.sup.2-P.sup.1].sub.m (1)
Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method of manufacturing electronic device, compound, and resin
An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (C) having a repeating unit represented by Formula (1). A pattern forming method includes a step of forming a film with the actinic ray-sensitive or radiation-sensitive resin composition, and a method of manufacturing an electronic device includes the pattern forming method, ##STR00001## in Formula (1), Z represents a halogen atom, a group represented by R.sub.11OCH.sub.2—, or a group represented by R.sub.12OC(═O)CH.sub.2—. R.sub.11 and R.sub.12 each represent a monovalent substituent. X represents an oxygen atom or a sulfur atom. L represents a (n+1)-valent linking group. R represents a group having a group that is decomposed due to the action of an alkali developer to increase solubility in an alkali developer, n represents a positive integer.
Material for cell patterning use
Disclosed are a cell culture substrate that can be modified from its cell-inadhesibleness to make it cell-adhesible, by a convenient and low-cost treatment, and particularly, a substrate that allows position-specific culture of one or more kinds of cells. The substrate has on its surface a layer made of a photomodifiable polymer that comprises a monomer, as component (A), represented by Formula (1): ##STR00001## wherein R1 denotes hydrogen or a methyl group, and R2 denotes an alkyl group having 1-22 carbon atoms, respectively, and n denotes an integer of 1-30, and a component (B) having a trialkoxysilyl group, which forms a layer.
Material for cell patterning use
Disclosed are a cell culture substrate that can be modified from its cell-inadhesibleness to make it cell-adhesible, by a convenient and low-cost treatment, and particularly, a substrate that allows position-specific culture of one or more kinds of cells. The substrate has on its surface a layer made of a photomodifiable polymer that comprises a monomer, as component (A), represented by Formula (1): ##STR00001## wherein R1 denotes hydrogen or a methyl group, and R2 denotes an alkyl group having 1-22 carbon atoms, respectively, and n denotes an integer of 1-30, and a component (B) having a trialkoxysilyl group, which forms a layer.