C08F222/106

COLORING COMPOSITION, METHOD FOR MANUFACTURING COLORING CURED FILM, COLORING CURED FILM, COLOR FILTER, AND ORGANIC EL DISPLAY DEVICE
20220350245 · 2022-11-03 · ·

A coloring composition is a coloring composition including a black colorant, a polymerizable compound, and a photopolymerization initiator, in which the photopolymerization initiator includes a photopolymerization initiator a in which a light absorption coefficient at 365 nm in methanol is more than 1.0×10.sup.2 mL/gcm and a photopolymerization initiator b in which a light absorption coefficient at 365 nm in methanol is 1.0×10.sup.2 mL/gcm or less and a light absorption coefficient at 254 nm is 1.0×10.sup.3 mL/gcm or more, a content of the photopolymerization initiator b is 45.0 to 200.0 parts by mass with respect to 100.0 parts by mass of a content of the photopolymerization initiator a, and a ratio of a maximum absorbance to a minimum absorbance of a coloring cured film obtained by curing the coloring composition at a wavelength of 400 to 700 nm is 1.0 to 2.5.

COLORING COMPOSITION, METHOD FOR MANUFACTURING COLORING CURED FILM, COLORING CURED FILM, COLOR FILTER, AND ORGANIC EL DISPLAY DEVICE
20220350245 · 2022-11-03 · ·

A coloring composition is a coloring composition including a black colorant, a polymerizable compound, and a photopolymerization initiator, in which the photopolymerization initiator includes a photopolymerization initiator a in which a light absorption coefficient at 365 nm in methanol is more than 1.0×10.sup.2 mL/gcm and a photopolymerization initiator b in which a light absorption coefficient at 365 nm in methanol is 1.0×10.sup.2 mL/gcm or less and a light absorption coefficient at 254 nm is 1.0×10.sup.3 mL/gcm or more, a content of the photopolymerization initiator b is 45.0 to 200.0 parts by mass with respect to 100.0 parts by mass of a content of the photopolymerization initiator a, and a ratio of a maximum absorbance to a minimum absorbance of a coloring cured film obtained by curing the coloring composition at a wavelength of 400 to 700 nm is 1.0 to 2.5.

Active energy ray curable composition, active energy ray curable ink, composition accommodating container, two or three dimensional image forming apparatus, two or three dimensional image forming method, cured matter, decorative matter, artificial nail composition, nail decorative material, and artificial nail

An active energy ray curable composition contains an acrylamide compound A1 represented by the following Chemical formula 1 or the following Chemical formula 2; a multi-functional polymerizable compound B1 having an SI value of 3 or less in a skin sensitivity test; a polymerization initiator C1 having no maximum absorption peak in a wavelength range of from 365 to 405 nm; and a hydrogen donor D, ##STR00001##

Active energy ray curable composition, active energy ray curable ink, composition accommodating container, two or three dimensional image forming apparatus, two or three dimensional image forming method, cured matter, decorative matter, artificial nail composition, nail decorative material, and artificial nail

An active energy ray curable composition contains an acrylamide compound A1 represented by the following Chemical formula 1 or the following Chemical formula 2; a multi-functional polymerizable compound B1 having an SI value of 3 or less in a skin sensitivity test; a polymerization initiator C1 having no maximum absorption peak in a wavelength range of from 365 to 405 nm; and a hydrogen donor D, ##STR00001##

Crosslinkable compositions having a low viscosity for coatings and materials having a high refractive index and having a high heat deflection temperature
11603424 · 2023-03-14 · ·

The invention relates to a crosslinkable composition, which comprises a component a) at least one halogenated bisphenol A diglycidyl ether tetra(meth)acrylate and a component b) at least one diluent from mono(meth)acrylates of a monoalcohol comprising a biphenyl structure, and at least one optional component from components c), d), e), f) and g). It also relates to its use for coatings or materials, in particular for 3D printed articles for optical applications, as it also relates to the crosslinked composition and to the finished product, in particular the 3D article which results therefrom.

Acrylic emulsions modified with functional (meth)acrylates to enable crosslinking

The present invention provides a method for crosslinking an acrylic emulsion with a (meth)acrylate monomer or a (meth)acrylate oligomer including adding a base acrylic emulsion to a vessel, adding at least one (meth)acrylate crosslinker to the vessel, incorporating the at least one (meth)acrylate crosslinker into the base acrylic emulsion to create a two-phase system including water and a phase including crosslinkers of the at least one (meth)acrylate crosslinker inside acrylic emulsion particles of the base acrylic emulsion, applying the two-phase system to a surface, and curing the two-phase system to create a final system including a continuous film and crosslinked crosslinkers.

PHOTOSENSITIVE RESIN COMPOSITION, AND FILM AND PRINTED CIRCUIT BOARD USING SAME
20170362361 · 2017-12-21 ·

A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

PHOTOSENSITIVE RESIN COMPOSITION, AND FILM AND PRINTED CIRCUIT BOARD USING SAME
20170362361 · 2017-12-21 ·

A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

SYSTEM AND METHOD FOR SEAMS IN RESILIENT SURFACE COVERING
20230193081 · 2023-06-22 ·

Included are methods for sealing seams of resilient surface covering including the application of a curable composition at a seam and applying radiation to the curable composition. The radiation may be any suitable source such as UV or visible light.

SYSTEM AND METHOD FOR SEAMS IN RESILIENT SURFACE COVERING
20230193081 · 2023-06-22 ·

Included are methods for sealing seams of resilient surface covering including the application of a curable composition at a seam and applying radiation to the curable composition. The radiation may be any suitable source such as UV or visible light.