A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. ##STR00001## In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. ##STR00001## In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.

A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.

##STR00001##

In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.

##STR00001##

In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

Polymers are provided, in which a pendant photoinitiator moiety is linked to the polymer structure via an amide or a succinimide.

The invention relates to a material formed by a polymer substrate and a hydrogel based on vinyl-lactams and ionic methacrylates. The invention also relates to a method for producing this material and to the use thereof for cell culture and cell monolayer engineering, for preparing 3D scaffolds and manufacturing thermosensitive mechanical actuators.

The invention relates to a material formed by a polymer substrate and a hydrogel based on vinyl-lactams and ionic methacrylates. The invention also relates to a method for producing this material and to the use thereof for cell culture and cell monolayer engineering, for preparing 3D scaffolds and manufacturing thermosensitive mechanical actuators.

A resin composition includes a vinyl-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination type ionic compound with a thermal resistance of greater than or equal to 600 C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.