C08F222/406

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line). ##STR00001## In the formula (1), R.sub.1, R.sub.2, and R.sub.3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R.sub.4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R.sub.5 and R.sub.6 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.

ACRYLIC COPOLYMER AND RUBBER MATERIAL
20210309846 · 2021-10-07 ·

It is an object of the present invention to provide an acrylic copolymer for providing a highly heat-resistant rubber material that shows a small rate of change in strength without loss of elongation, even under a high-temperature condition over a long period, and a composition containing the acrylic copolymer. The present invention provides an acrylic copolymer comprising a structural unit (A) derived from a monomer containing a structure having a maleimide skeleton, a structural unit (B) derived from an acrylic acid alkyl ester and/or a structural unit (B) derived from an acrylic acid alkoxyalkyl ester, and a structural unit (C) derived from an unsaturated monomer having a crosslinking group; a composition comprising the acrylic copolymer and a crosslinking group; and a rubber material produced from the composition.

ACRYLIC COPOLYMER AND RUBBER MATERIAL
20210309846 · 2021-10-07 ·

It is an object of the present invention to provide an acrylic copolymer for providing a highly heat-resistant rubber material that shows a small rate of change in strength without loss of elongation, even under a high-temperature condition over a long period, and a composition containing the acrylic copolymer. The present invention provides an acrylic copolymer comprising a structural unit (A) derived from a monomer containing a structure having a maleimide skeleton, a structural unit (B) derived from an acrylic acid alkyl ester and/or a structural unit (B) derived from an acrylic acid alkoxyalkyl ester, and a structural unit (C) derived from an unsaturated monomer having a crosslinking group; a composition comprising the acrylic copolymer and a crosslinking group; and a rubber material produced from the composition.

Composition, cured product and laminate

An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

RESIN COMPOSITION, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAID RESIN COMPOSITION

A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

RESIN COMPOSITION, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAID RESIN COMPOSITION

A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

Preparation of maleate and maleimide monomers and polymeric materials from triglycerides

Monomer compounds and methods of synthesizing monomer compounds are disclosed. The monomer compounds can include maleate and maleimide monomers having fatty acid moieties. The monomer compounds can be derived from renewable sources such as corn, soybean, and sunflower oils. The monomer compounds can be formed into homopolymers as well as copolymers. The copolymers can include petroleum-derived monomers such as styrene, ethylene, and propylene.

Preparation of maleate and maleimide monomers and polymeric materials from triglycerides

Monomer compounds and methods of synthesizing monomer compounds are disclosed. The monomer compounds can include maleate and maleimide monomers having fatty acid moieties. The monomer compounds can be derived from renewable sources such as corn, soybean, and sunflower oils. The monomer compounds can be formed into homopolymers as well as copolymers. The copolymers can include petroleum-derived monomers such as styrene, ethylene, and propylene.

COMPOSITION, CURED PRODUCT AND LAMINATE

An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device

An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer. ##STR00001##