The present disclosure provides a composition. In an embodiment, the composition is an ethylene-based polymer composition formed by high pressure (greater or equal to 100 MPa) free radical polymerization. The composition includes ethylene monomer and a mixture of hydrocarbon-based molecules. Each hydrocarbon-based molecule includes three or more internal alkene groups.

The present disclosure provides a composition. In an embodiment, the composition is an ethylene-based polymer composition formed by high pressure (greater or equal to 100 MPa) free radical polymerization. The composition includes ethylene monomer and a mixture of hydrocarbon-based molecules. Each hydrocarbon-based molecule includes three or more internal alkene groups.

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm.sup.3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm.sup.3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.

In some embodiments, ethylene-propylene random copolymers as viscosity modifiers were synthesized with pyridyldiamido catalyst systems and a chain transfer agent. In some embodiments, the present disclosure provides for ethylene-propylene random copolymers having an ethylene content between about 45 wt % and about 55 wt %. In some embodiments, the ethylene-propylene random copolymer is used as a viscosity modifier in a lubricating composition and a fuel composition.

In some embodiments, ethylene-propylene random copolymers as viscosity modifiers were synthesized with pyridyldiamido catalyst systems and a chain transfer agent. In some embodiments, the present disclosure provides for ethylene-propylene random copolymers having an ethylene content between about 45 wt % and about 55 wt %. In some embodiments, the ethylene-propylene random copolymer is used as a viscosity modifier in a lubricating composition and a fuel composition.

Ethylene-based polymers having a density of 0.952 to 0.968 g/cm.sup.3, a ratio of HLMI/MI from 185 to 550, an IB parameter from 1.46 to 1.80, a tan δ at 0.1 sec.sup.−1 from 1.05 to 1.75 degrees, and a slope of a plot of viscosity versus shear rate at 100 sec.sup.−1 from 0.18 to 0.28 are described, with low melt flow versions having a HLMI from 10 to 30 g/10 min and a Mw from 250,000 to 450,000 g/mol, and high melt flow versions having a HLMI from 30 to 55 g/10 min and a Mw from 200,000 to 300,000 g/mol. These polymers have the processability of chromium-based resins, but with improved stress crack resistance and topload strength for bottles and other blow molded products.

Ethylene-based polymers having a density of 0.952 to 0.968 g/cm.sup.3, a ratio of HLMI/MI from 185 to 550, an IB parameter from 1.46 to 1.80, a tan δ at 0.1 sec.sup.−1 from 1.05 to 1.75 degrees, and a slope of a plot of viscosity versus shear rate at 100 sec.sup.−1 from 0.18 to 0.28 are described, with low melt flow versions having a HLMI from 10 to 30 g/10 min and a Mw from 250,000 to 450,000 g/mol, and high melt flow versions having a HLMI from 30 to 55 g/10 min and a Mw from 200,000 to 300,000 g/mol. These polymers have the processability of chromium-based resins, but with improved stress crack resistance and topload strength for bottles and other blow molded products.

The present application relates to a polypropylene composition having a melt flow rate MFR.2 (230° C.) measured according to ISO 1133 in the range of 5 to 50 g/10 min, to a composition comprising the polypropylene composition and one or more additive(s) in an amount of up to 4 wt.-%, based on the total weight of the composition, to a process for the preparation of the polypropylene composition and an article comprising the polypropylene composition as well as the use of the polypropylene composition for decreasing the brittle-to-ductile transition temperature.

The present application relates to a polypropylene composition having a melt flow rate MFR.2 (230° C.) measured according to ISO 1133 in the range of 5 to 50 g/10 min, to a composition comprising the polypropylene composition and one or more additive(s) in an amount of up to 4 wt.-%, based on the total weight of the composition, to a process for the preparation of the polypropylene composition and an article comprising the polypropylene composition as well as the use of the polypropylene composition for decreasing the brittle-to-ductile transition temperature.