C08F261/02

Silicone-based hydrophilic copolymer and hydrogel compositions comprising the same

A hydrophilic siloxane copolymer of siloxane and hydrophilic organic monomer/s The copolymers can be functionalized to make them capable of undergoing further polymerization by thermal or actinic radiations. The hydrophilicity of these polymers can be varied by varying the siloxane versus organic monomer ratio thereby going from water dispersible to soluble states. The siloxane content can be tuned accordingly in order to provide moderate to high oxygen permeability. These copolymers can be used as a single component curable composition which results in hydrogels to minimize the presence of leachable components thus by reducing the processing cost. The polymers may also find applications in personal care formulations as copolymers, film-formers, hydrogels, coating, emulsions/latex etc.

Silicone-based hydrophilic copolymer and hydrogel compositions comprising the same

A hydrophilic siloxane copolymer of siloxane and hydrophilic organic monomer/s The copolymers can be functionalized to make them capable of undergoing further polymerization by thermal or actinic radiations. The hydrophilicity of these polymers can be varied by varying the siloxane versus organic monomer ratio thereby going from water dispersible to soluble states. The siloxane content can be tuned accordingly in order to provide moderate to high oxygen permeability. These copolymers can be used as a single component curable composition which results in hydrogels to minimize the presence of leachable components thus by reducing the processing cost. The polymers may also find applications in personal care formulations as copolymers, film-formers, hydrogels, coating, emulsions/latex etc.

Silicone-based hydrophilic copolymer and hydrogel compositions comprising the same

A hydrophilic siloxane copolymer of siloxane and hydrophilic organic monomer/s The copolymers can be functionalized to make them capable of undergoing further polymerization by thermal or actinic radiations. The hydrophilicity of these polymers can be varied by varying the siloxane versus organic monomer ratio thereby going from water dispersible to soluble states. The siloxane content can be tuned accordingly in order to provide moderate to high oxygen permeability. These copolymers can be used as a single component curable composition which results in hydrogels to minimize the presence of leachable components thus by reducing the processing cost. The polymers may also find applications in personal care formulations as copolymers, film-formers, hydrogels, coating, emulsions/latex etc.

SILICONE-BASED HYDROPHILIC COPOLYMER AND HYDROGEL COMPOSITIONS COMPRISING THE SAME

A hydrophilic siloxane copolymer of siloxane and hydrophilic organic monomer/s The copolymers can be functionalized to make them capable of undergoing further polymerization by thermal or actinic radiations. The hydrophilicity of these polymers can be varied by varying the siloxane versus organic monomer ratio thereby going from water dispersible to soluble states. The siloxane content can be tuned accordingly in order to provide moderate to high oxygen permeability. These copolymers can be used as a single component curable composition which results in hydrogels to minimize the presence of leachable components thus by reducing the processing cost. The polymers may also find applications in personal care formulations as copolymers, film-formers, hydrogels, coating, emulsions/latex etc.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

The present disclosure provides a resin composition and an article made therefrom, and the article comprises a prepreg, a resin film, a laminate, or a printed circuit board. The resin composition comprises (A) 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin and (B) 20 parts by weight to 60 parts by weight of a phosphorus-containing compound represented by Formula (1). The article has an improvement in at least one or more or all of the glass transition temperature, the dielectric constant, the dissipation factor, the flame retardancy, the percent thermal expansion at Z-axis, the water absorption rate, the interlayer bonding strength, and alkali resistance.

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RESIN COMPOSITION AND ARTICLE MADE THEREFROM

The present disclosure provides a resin composition and an article made therefrom, and the article comprises a prepreg, a resin film, a laminate, or a printed circuit board. The resin composition comprises (A) 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin and (B) 20 parts by weight to 60 parts by weight of a phosphorus-containing compound represented by Formula (1). The article has an improvement in at least one or more or all of the glass transition temperature, the dielectric constant, the dissipation factor, the flame retardancy, the percent thermal expansion at Z-axis, the water absorption rate, the interlayer bonding strength, and alkali resistance.

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Actinic ray-sensitive or radiation-sensitive resin composition, and, actinic ray-sensitive or radiation-sensitive film and pattern forming method, each using the composition

An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M.sup.11 represents a single bond or a divalent linking group; Q.sup.11 represents an alkyl group, a cycloalkyl group, or an aryl group). ##STR00001##

Actinic ray-sensitive or radiation-sensitive resin composition, and, actinic ray-sensitive or radiation-sensitive film and pattern forming method, each using the composition

An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M.sup.11 represents a single bond or a divalent linking group; Q.sup.11 represents an alkyl group, a cycloalkyl group, or an aryl group). ##STR00001##