Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

This invention relates to a process for preparing succinic acid and succinate ester from a succinic acid salt in fermentation broth. In the first stage of this invention, renewable carbon resources are utilized to produce succinic acid through biological fermentation. The succinic acid salt in the fermentation process is subjected to double displacement reaction with a strong acid leading to release of succinic acid. Succinic acid is recovered by fractional crystallization integrated with simulated moving bed chromatography to produce succinic acid and succinate ester.

Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: (a) a maleimide represented by the following formula (1):

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q independently represents an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a (meth)acrylate; (c) inorganic particles; and (d) a curing catalyst.

Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: (a) a maleimide represented by the following formula (1):

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q independently represents an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a (meth)acrylate; (c) inorganic particles; and (d) a curing catalyst.

Provided are a UV-curable non-isocyanate polyurea polymer and a UV-curable coating composition containing the same. The UV-curable non-isocyanate polyurea polymer has one or more ethylenically unsaturated functional groups and the ethylenically unsaturated functional groups are attached to nitrogen atoms present in a backbone urea segment via —C(=0)- linkage. The nonisocyanate polyurea polymer is prepared by: (i) providing an ethylenically unsaturated compound having one or more carboxylic acid functional groups; and (ii) reacting said ethylenically unsaturated compound having one or more carboxylic acid functional groups with a multi-carbodiimide polymer to form the non-isocyanate polyurea polymer.

Provided are a UV-curable non-isocyanate polyurea polymer and a UV-curable coating composition containing the same. The UV-curable non-isocyanate polyurea polymer has one or more ethylenically unsaturated functional groups and the ethylenically unsaturated functional groups are attached to nitrogen atoms present in a backbone urea segment via —C(=0)- linkage. The nonisocyanate polyurea polymer is prepared by: (i) providing an ethylenically unsaturated compound having one or more carboxylic acid functional groups; and (ii) reacting said ethylenically unsaturated compound having one or more carboxylic acid functional groups with a multi-carbodiimide polymer to form the non-isocyanate polyurea polymer.

An electrolyte for a lithium secondary battery is disclosed herein. In some embodiments, an electrolyte includes a lithium salt having a concentration of 1.6 M to 5 M, an oligomer mixture which includes a first oligomer containing a unit represented by Formula 1 and a second oligomer containing a unit represented by Formula 2, and an organic solvent.

A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.

A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.