A compound of formula 1:

##STR00001##

where X and Y are each a different optional organic group. When there is a plurality of X, each X in the plurality of X may be the same as or different from each other. When there is a plurality of Y, each Y in the plurality of Y may be the same as or different from each other. R represents a hydrocarbon group having 1 to 10 carbon atoms or a halogenated alkyl group. When there is a plurality of R, each R in the plurality of R may be the same as or different from each other. Variable m is an integer of 0 to 3, n is a repeating unit and satisfies 1≤n≤20, and p is a repeating unit and satisfies 0≤p≤20.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

The present invention provides a radome substrate and a preparation method thereof. The radome substrate includes: 5 to 10 parts of polyphenylene ether resin, 70 to 85 parts of ceramic masterbatch, 10 to 15 parts of hollow microbead masterbatch, 1 to 3 parts of a compatibilizer, and 0.1 to 0.3 parts of a lubricant. The radome substrate prepared according to the method provided in the present invention has a high dielectric constant and stress cracking resistance performance.

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

The invention relates to a composite formulation comprising a specific mediator additive component (A) of relatively high molecular weight, a filler component (B) and a binder component (C). The composite formulation can be cured to a composite which is especially suitable for the production of moldings.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##