Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, ##STR00001## wherein TA represents a tannic acid moiety, R.sup.1 represents an optionally substituted C.sub.1-C.sub.6 straight or branched alkyl, an optionally substituted C.sub.3-C.sub.6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, ##STR00001## wherein TA represents a tannic acid moiety, R.sup.1 represents an optionally substituted C.sub.1-C.sub.6 straight or branched alkyl, an optionally substituted C.sub.3-C.sub.6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, ##STR00001## wherein TA represents a tannic acid moiety, R.sup.1 represents an optionally substituted C.sub.1-C.sub.6 straight or branched alkyl, an optionally substituted C.sub.3-C.sub.6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.

A resin composition and a resin film are provided. The resin composition includes a hardener and an epoxy resin monomer. The epoxy resin monomer has a structure represented by Formula (I)

##STR00001##

wherein A is substituted or unsubstituted C.sub.6-24 arylene group, C.sub.3-16 cycloalkylene group, C.sub.3-16 heteroarylene group, C.sub.3-16 alicyclic alkylene group, or divalent C.sub.6-25 alkylaryl group; X.sup.1 and X.sup.2 are independently

##STR00002##

Y.sup.1 and Y.sup.2 are independently substituted or unsubstituted C.sub.6-24 arylene group, and Y.sup.1 is different from Y.sup.2; and R.sup.1 is hydrogen, C.sub.1-8 alkyl group, or C.sub.1-8 alkoxy group, wherein the weight ratio of the curing agent to the epoxy resin monomer having a structure represented by Formula (I) is from 1:100 to 1:1.

A resin composition and a resin film are provided. The resin composition includes a hardener and an epoxy resin monomer. The epoxy resin monomer has a structure represented by Formula (I)

##STR00001##

wherein A is substituted or unsubstituted C.sub.6-24 arylene group, C.sub.3-16 cycloalkylene group, C.sub.3-16 heteroarylene group, C.sub.3-16 alicyclic alkylene group, or divalent C.sub.6-25 alkylaryl group; X.sup.1 and X.sup.2 are independently

##STR00002##

Y.sup.1 and Y.sup.2 are independently substituted or unsubstituted C.sub.6-24 arylene group, and Y.sup.1 is different from Y.sup.2; and R.sup.1 is hydrogen, C.sub.1-8 alkyl group, or C.sub.1-8 alkoxy group, wherein the weight ratio of the curing agent to the epoxy resin monomer having a structure represented by Formula (I) is from 1:100 to 1:1.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.