An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

A waterproof wax, a waterproof treatment method for a splicing part of floorboards and a splice floorboard, relating to floorboards. The waterproof wax includes 60-85% by weight of a first paraffin, 1-15% by weight of a silicone resin, 10-20% by weight of ethylene glycol dimethacrylate, 2-5% by weight of amino silicone oil and 0.1-1% by weight of alkenyl succinate.

A waterproof wax, a waterproof treatment method for a splicing part of floorboards and a splice floorboard, relating to floorboards. The waterproof wax includes 60-85% by weight of a first paraffin, 1-15% by weight of a silicone resin, 10-20% by weight of ethylene glycol dimethacrylate, 2-5% by weight of amino silicone oil and 0.1-1% by weight of alkenyl succinate.

The invention relates to a process of processing a radiation-curable composition with an additive-manufacturing technique comprising a radiation-curing step, the radiation-curable composition comprising mercapto-functional Component A comprising at least three mercapto moieties, crosslinker Component B with at least three vinyl or allyl moieties, photo-initiator(s) Component C for initiating a curing reaction between Component A and Component B, wherein the radiation-curable composition does not comprise urethane (meth)acrylate oligomers in an amount of more than 4 wt. % with respect to the whole composition. 3-dim articles which can be produced are typically transparent and have adequate mechanical properties. The radiation-curable composition is in particular useful for producing clear-tray aligners for dental and orthodontic purposes.

The invention relates to a process of processing a radiation-curable composition with an additive-manufacturing technique comprising a radiation-curing step, the radiation-curable composition comprising mercapto-functional Component A comprising at least three mercapto moieties, crosslinker Component B with at least three vinyl or allyl moieties, photo-initiator(s) Component C for initiating a curing reaction between Component A and Component B, wherein the radiation-curable composition does not comprise urethane (meth)acrylate oligomers in an amount of more than 4 wt. % with respect to the whole composition. 3-dim articles which can be produced are typically transparent and have adequate mechanical properties. The radiation-curable composition is in particular useful for producing clear-tray aligners for dental and orthodontic purposes.

This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.

This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.

Described are silicone hydrogels with high levels of polyamides exhibiting an excellent balance of physical, mechanical, and biological properties. The silicone hydrogels are formed from a reactive monomer mixture comprising: a hydroxylalkyl (meth)acrylate monomer; hydroxyl-containing silicone components; and a polyamide, wherein the polyamide is present in an amount greater than 15 weight percent, based on the total weight of reactive components in the reactive monomer mixture.

The present invention relates to a molding compound containing A) 45 to 65 wt. % of at least one aromatic polycarbonate, polyester carbonate or mixtures thereof, B) 18 to 31 wt. % of at least one polybutylene terephthalate having rheological properties of 5 g/10 min to 30 g/10 min determined according to DIN EN ISO 1133 at 250° C. measuring temperature and a load of 2.16 kg, C) 3 to 10 wt % of at least one rubber-modified graft polymer with a graft base consisting of a silicone-acrylate composite rubber and a silicone rubber content of 20 to 60 wt. % relative to the graft base, D) 8 to 13 wt. % of at least one phosphazene, and E) 0 to 8.0 wt. % of at least one polymer additive, the weight ratio of components D to C) being in the range of 1.3:1 to 2.5:1. The invention also relates to a method for producing the molding compound, to the use of the molding compound for producing moldings and to the moldings as such.