A water-based acrylic resin and a method for producing the same are provided. The water-based acrylic resin includes a polymerizable composition. The polymerizable composition includes deionized water, a reactive emulsifier, a first acrylic monomer, a second acrylic monomer, a third acrylic monomer, a fourth acrylic monomer, and an acrylic polyol. The reactive emulsifier is a nonylphenyl-free reactive emulsifier. The first acrylic monomer is an alkyl-containing (meth)acrylate. The second acrylic monomer is a hydroxyl-containing (meth)acrylate. The third acrylic monomer is a carboxyl-containing (meth)acrylate. The fourth acrylic monomer is an ethylenically-unsaturated-functional-groups-containing (meth)acrylate. The acrylic polyol is one or both of a hydroxyl-containing polyester acrylic polyol and a hydroxyl-containing polyether acrylic polyol.

A water-based acrylic resin and a method for producing the same are provided. The water-based acrylic resin includes a polymerizable composition. The polymerizable composition includes deionized water, a reactive emulsifier, a first acrylic monomer, a second acrylic monomer, a third acrylic monomer, a fourth acrylic monomer, and an acrylic polyol. The reactive emulsifier is a nonylphenyl-free reactive emulsifier. The first acrylic monomer is an alkyl-containing (meth)acrylate. The second acrylic monomer is a hydroxyl-containing (meth)acrylate. The third acrylic monomer is a carboxyl-containing (meth)acrylate. The fourth acrylic monomer is an ethylenically-unsaturated-functional-groups-containing (meth)acrylate. The acrylic polyol is one or both of a hydroxyl-containing polyester acrylic polyol and a hydroxyl-containing polyether acrylic polyol.

The present invention relates to the synthesis of polymer polyols in unsaturated polyols as liquid phase, polymer polyols and their use.

Provided herein are micellic assemblies comprising a plurality of copolymers. In certain instauces, micellic assemblies provided herein are pH sensitive particles.

An adhesive composition that contains two polymeric materials, a method of making the adhesive composition, and an article that contains the adhesive composition are provided. One of the polymeric materials is derived from a (meth)acrylate macromer having a poly(tetrahydrofuran) group. The articles include a layer of the adhesive composition positioned next to a substrate. The articles can be, for example, an adhesive tape or can be part of another article such as, for example, an electronic device that is impact resistant and/or flexible.

An adhesive composition that contains two polymeric materials, a method of making the adhesive composition, and an article that contains the adhesive composition are provided. One of the polymeric materials is derived from a (meth)acrylate macromer having a poly(tetrahydrofuran) group. The articles include a layer of the adhesive composition positioned next to a substrate. The articles can be, for example, an adhesive tape or can be part of another article such as, for example, an electronic device that is impact resistant and/or flexible.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.