[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution Means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation.

[Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25° C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25° C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 μm or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation.

[Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25° C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25° C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 μm or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a first oligomer comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the first oligomer comprises a polyepoxide based on Bisphenol A, F, or S, a polyepoxide based on hydrogenated Bisphenol A, F, or S, a polycarbonate, or a polyimide. The composition may further comprise a second network-forming component.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a first oligomer comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the first oligomer comprises a polyepoxide based on Bisphenol A, F, or S, a polyepoxide based on hydrogenated Bisphenol A, F, or S, a polycarbonate, or a polyimide. The composition may further comprise a second network-forming component.

A method of recycling a polymer structure includes converting a first polymer structure into feedstock. The first polymer structure comprises particles that are bonded to one another by chemical click bonds to form a first shape. The first polymer structure is converted into feedstock particles by breaking the click bonds. The feedstock particles are formed into a second shape, and the feedstock particles are chemically click-bonded together to form a second polymer structure having a second shape. Breaking the click bonds may include heating the particles. The structures may be formed by causing first particles having dienes to chemically bond to dienophiles of second particles.

Provided are a radical-polymerizable resin composition and a structure repairing material which, when used for repairing concrete structures, enable construction working even in a low-temperature environment, achieve a high strength and a low shrinkage by curing, and prevent cracking. The radical-polymerizable resin composition contains a radical-polymerizable resin (A) containing at least one selected from the group consisting of a vinyl ester resin, an urethane (meth)acrylate resin, and a polyester (meth)acrylate resin, a radical-polymerizable monomer (B) containing an isobornyl group-having unsaturated compound (B1), and a hydroxy group-containing aromatic tertiary amine (C) represented by the general formula (I), and containing the radical-polymerizable resin (A) and the radical-polymerizable monomer (B) in a total amount of 75% by mass or more. The structure repairing material contains the radical-polymerizable resin composition, an organic peroxide, and a filler (Z).

Provided are a radical-polymerizable resin composition and a structure repairing material which, when used for repairing concrete structures, enable construction working even in a low-temperature environment, achieve a high strength and a low shrinkage by curing, and prevent cracking. The radical-polymerizable resin composition contains a radical-polymerizable resin (A) containing at least one selected from the group consisting of a vinyl ester resin, an urethane (meth)acrylate resin, and a polyester (meth)acrylate resin, a radical-polymerizable monomer (B) containing an isobornyl group-having unsaturated compound (B1), and a hydroxy group-containing aromatic tertiary amine (C) represented by the general formula (I), and containing the radical-polymerizable resin (A) and the radical-polymerizable monomer (B) in a total amount of 75% by mass or more. The structure repairing material contains the radical-polymerizable resin composition, an organic peroxide, and a filler (Z).