The present invention aims to provide a curable resin composition that can retain low viscosity and exhibit properties appropriate for application, even when the curable resin composition contains a high viscosity component. The present invention relates to an active energy ray-curable resin composition containing: a crosslinkable compound (A); an oligomer (B) having a viscosity at 25° C. of 1000 mPa.Math.s or higher or a viscosity at 60° C. of 400 mPa.Math.s or higher; and a polymerization initiator (C), the crosslinkable compound (A) being represented by the following formula (1):

##STR00001##

wherein Z is an n-valent linking group, with n being an integer of 2 or greater.

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

Styrene-free unsaturated polyester resin and vinyl ester resin compositions are provided which contain low amounts of hazardous air pollutants, good mechanical and physical properties, and good corrosion resistant characteristics. The resin systems are such that minimal or no component is leachable after completion of the curing process. The resins are suitable for repair of sewer pipes and potable water pipe systems as part of a cured-in-place pipe application. Additionally, the invention is suitable for relining of storage tanks. A process for the manufacture of these resin compositions is also provided.

Provided is a prepreg containing a urethane (meth)acrylate (A), an ethylenically unsaturated monomer (B), a polymerization initiator (C), and reinforcement fibers (D), characterized in that the urethane (meth)acrylate (A) is a reaction product of a polyisocyanate (a1) and a polyol (a2) having an ethylenically unsaturated group and an aromatic skeleton, and/or a reaction product of a polyisocyanate (a1), a polyol (a3) not having an ethylenically unsaturated group but having an aromatic skeleton, and a hydroxyalkyl (meth)acrylate (a4), and that the ethylenically unsaturated monomer (B) has a molecular weight of 320 or more and a weight reduction rate (%) of less than 2 when heated under atmospheric pressure at 150° C. for 3 minutes. The prepreg has excellent moldability and enables to produce a molded article having excellent physical properties such as flexural strength and interlaminar shear strength, and therefore the prepreg can be suitably used in automobile components and the like.

Provided is a prepreg containing a urethane (meth)acrylate (A), an ethylenically unsaturated monomer (B), a polymerization initiator (C), and reinforcement fibers (D), characterized in that the urethane (meth)acrylate (A) is a reaction product of a polyisocyanate (a1) and a polyol (a2) having an ethylenically unsaturated group and an aromatic skeleton, and/or a reaction product of a polyisocyanate (a1), a polyol (a3) not having an ethylenically unsaturated group but having an aromatic skeleton, and a hydroxyalkyl (meth)acrylate (a4), and that the ethylenically unsaturated monomer (B) has a molecular weight of 320 or more and a weight reduction rate (%) of less than 2 when heated under atmospheric pressure at 150° C. for 3 minutes. The prepreg has excellent moldability and enables to produce a molded article having excellent physical properties such as flexural strength and interlaminar shear strength, and therefore the prepreg can be suitably used in automobile components and the like.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

Thermoset compositions and methods for forming three-dimensional articles via an additive fabrication process, and articles made therefrom are disclosed herein. In an embodiment, a composition comprises a first network-forming component comprising a TPA-based polyester comprising a backbone and having at least 2 polymerizable groups, one or more first network monomers, and a first network initiator. The backbone of the TPA-based polyester comprises the reaction product of a terephthalic acid and a polyol. The composition may further comprise a second network-forming component.

[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution Means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.