[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation.

[Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25° C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25° C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 μm or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation.

[Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25° C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25° C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 μm or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

Provided is a fiber-reinforced molding material containing a thickening substance (A) containing a vinyl ester resin (a1), an unsaturated monomer (a2), a polyisocyanate (a3), and a polymerization initiator (a4) as essential raw materials and carbon fibers (B) with a fiber length of 2.5 mm to 50 mm. The thickening substance (A) satisfies conditions (1) to (3) below as measured with a rheometer. (1) The maximum value of the rate of change in viscosity in a temperature region lower than a temperature Xa indicating the lowest melt viscosity A is 100 Pa.Math.s/° C. to 1,500 Pa.Math.s/° C. (2) The maximum value of the rate of change in viscosity in a temperature region higher than or equal to the temperature Xa is 1,000 Pa.Math.s/° C. to 10,000 Pa.Math.s/° C. (3) The lowest melt viscosity A is 10 Pa.Math.s to 1,000 Pa.Math.s and the temperature Xa is 70 ° C. to 140 ° C.

Provided is a fiber-reinforced molding material containing a thickening substance (A) containing a vinyl ester resin (a1), an unsaturated monomer (a2), a polyisocyanate (a3), and a polymerization initiator (a4) as essential raw materials and carbon fibers (B) with a fiber length of 2.5 mm to 50 mm. The thickening substance (A) satisfies conditions (1) to (3) below as measured with a rheometer. (1) The maximum value of the rate of change in viscosity in a temperature region lower than a temperature Xa indicating the lowest melt viscosity A is 100 Pa.Math.s/° C. to 1,500 Pa.Math.s/° C. (2) The maximum value of the rate of change in viscosity in a temperature region higher than or equal to the temperature Xa is 1,000 Pa.Math.s/° C. to 10,000 Pa.Math.s/° C. (3) The lowest melt viscosity A is 10 Pa.Math.s to 1,000 Pa.Math.s and the temperature Xa is 70 ° C. to 140 ° C.

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation. [Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25? C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25? C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 ?m or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation. [Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa.Math.s or more and 200 dPa.Math.s or less at 25? C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa.Math.s or more and 300 dPa.Math.s or less at 25? C. at 5 rpm, wherein the dispersity of a mixture of the A agent and the B agent is 20 ?m or less on a grind gauge, and wherein, with respect to the total amount of the A agent and the B agent, the mixing ratio of the A agent is 75 mass % or more and less than 100 mass %, and the mixing ratio of the B agent is more than 0 mass % and 25 mass % or less.

The present invention provides a radically polymerizable resin composition which is capable of suppressing change in strength of a cured product thereof due to exposure to a high-temperature environment. The radically polymerizable resin composition according to the present invention contains a radically polymerizable resin (A), an ethylenically unsaturated compound (B), a hindered phenolic compound (C), and a hindered amine compound (D).

The present invention provides a radically polymerizable resin composition which is capable of suppressing change in strength of a cured product thereof due to exposure to a high-temperature environment. The radically polymerizable resin composition according to the present invention contains a radically polymerizable resin (A), an ethylenically unsaturated compound (B), a hindered phenolic compound (C), and a hindered amine compound (D).