This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.

A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.

A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: ##STR00001##
photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: ##STR00002##
and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: ##STR00001##
photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: ##STR00002##
and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.

There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance. The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.

There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance. The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of:

##STR00001##

photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of:

##STR00002##

and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.