A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

The present invention provides a method for producing a catalyst for polymerization of an olefin, which suppresses a decrease in polymerization activity due to early deactivation of the active site after the catalyst has been formed, exhibits excellent catalyst activity at the time of polymerization of olefins, and can produce polymers of olefins, which are excellent in stereoregularity. The method for producing a catalyst for polymerization of an olefin includes contacting a solid catalyst component (A) containing magnesium, titanium, halogen and an internal electron-donating compound, and a specific organoaluminum compound (B) represented by the general formula (I), with each other, wherein at least one selected from the solid catalyst component (A) and the organoaluminum compound (B) is previously subjected to contact treatment with a hydrocarbon compound having one or more vinyl groups.

The present invention is directed to a process for preparing light curable energetic polymeric binders. The process for preparing such binder comprises the steps of mixing a pre-polymer such as PGN or GAP having a terminal hydroxyl group with a solvent and adding reactants wherein the reactant has a light curable moiety and a pre-polymer reactive moiety. Catalysts such as carbodiimide and DMAP may be further added to the mixture.

Aspects of the invention include a method for synthesizing a peptide brush polymer, the method comprising: exposing a mixture comprising peptide-containing monomers, one or more photoinitiators, and one or more chain transfer agents to a light sufficient to induce photopolymerization, and photopolymerizing the peptide-containing monomers in the mixture; wherein: the resulting peptide brush polymer comprises at least one peptide-containing polymer block; the at least one peptide-containing polymer block is characterized by a degree of polymerization of at least 10 and a peptide graft density of 50% to 100%; and at least one peptide moiety of the at least one peptide-containing polymer block has 5 or more amino acid groups.

Functionalized compounds including residues of one or more 1,1-disubstituted alkene compounds. Preferably the functionalized compound includes the residue of two or more 1,1-disubstituted alkene compounds, which are spaced apart. The functionalized compound may be produced by a transesterification reaction. The functionalized compounds may be employed in a polymerizable composition and may be used to prepare new polymers, (for example by reacting the alkene group).

A monomer capable forming a polymer through ring-opening metathesis polymerization and capable of depolymerization thereafter through ring-closing metathesis, wherein the monomer comprises a cycloalkene having a fused ring attached thereto to form a cycloalkene-fused ring monomer, wherein the fused ring decreases the ring strain energy of the cycloalkene to a lower ring strain energy state of 5.3 kcal/mol or lower as compared to the same cycloalkene without the fused ring having a ring strain energy above 5.3 kcal/mol and wherein the cycloalkene-fused ring monomer is capable of isomerization into a higher ring strain energy state before polymerization and method of synthesizing the monomer. The monomer is further capable of forming chemically recyclable to monomers block copolymers.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

The present invention provides a resin composition comprising maleimide-containing pre-polymerized resin and article made therefrom. The resin composition comprises: 100 weight parts of vinyl-containing polyphenylene ether resin; 35 to 45 weight parts of bis(vinylphenyl)ethane; and 30 to 60 weight parts of maleimide-containing pre-polymerized resin; wherein the maleimide-containing pre-polymerized resin is obtained by pre-polymerization of aromatic maleimide resin and long chain maleimide resin. The articles made from the resin composition improve at least one characteristic of glass transition temperature variation, copper foil peeling strength, percentage of thermal expansion, coefficient of thermal expansion and surface appearance.

A 2-cyanoacrylate compound represented by Formula (1) and an adhesive composition containing the 2-cyanoacrylate compound represented by Formula (1). In Formula (1), R.sup.1 represents a divalent linking group having 1 to 20 carbon atoms, R.sup.2 and R.sup.3 each independently represent an alkylene group having 2 to 4 carbon atoms, and R.sup.4 represents an alkyl group having 1 to 20 carbon atoms.

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Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.