Provided is a polymer functioning as a leveling agent that imparts high smoothness to a coating film. Specifically, a polymer containing a polymer block (A1) of a polymerizable monomer (a1) having a functional group represented by —Si[OSi(R).sub.3].sub.n[R′].sub.3-n (n is an integer of 1 to 3, each R independently represents an alkyl group having 1 to 3 carbon atoms, and each R′ independently represents an alkyl group having 1 to 3 carbon atoms). Also provided are a coating composition, a resist composition, and an article containing the polymer.

Provided is a fluorine-containing siloxane acrylate represented by formula (1).

X—Z-PFPE-Z—X   (1)

[PFPE is a divalent perfluoropolyether chain, X is a group represented by formula (2)

##STR00001##

{Y.sup.1 is a divalent organic group, R.sup.2 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, and G is a monovalent hydrocarbon group or a group represented by formula (3)

O—Si(CH.sub.3).sub.2—Y.sup.1—OR.sup.1   (3)

(R.sup.1 is a monovalent hydrocarbon group, and Y.sup.1 is same as mentioned above. The broken line represents a bond (hereinafter, the same shall apply.)) Q is a hydrogen atom or a group represented by formula (4)

SiR.sup.3.sub.3   (4)

(R.sup.3 is a monovalent hydrocarbon group.) e is an integer of 0-2, f is an integer of 0-2, and g is an integer of 1-3, and e+f+g is 3.} Z is a predetermined divalent organic group.]

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

The present invention relates to a photopolymer composition for hologram formation, comprising: a polymer matrix comprising a siloxane-based polymer and a (meth)acrylate polymer containing one or more reactive functional groups in the side chains, a holographic recording method, and an optical element.

Described herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymers, methods of making and use thereof, and devices comprising the compositions described herein. Disclosed herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymer derived from: a polysiloxane prepolymer comprising a polyglycerol side chain, the polyglycerol side chain comprising an ethylenically unsaturated group covalently linked thereto, wherein the ethylenically unsaturated group is actinically curable.

There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm.sup.2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa.Math.s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa.Math.s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

Functionalized compounds including residues of one or more 1,1-disubstituted alkene compounds. Preferably the functionalized compound includes the residue of two or more 1,1-disubstituted alkene compounds, which are spaced apart. The functionalized compound may be produced by a transesterification reaction. The functionalized compounds may be employed in a polymerizable composition and may be used to prepare new polymers, (for example by reacting the alkene group).