Patent classifications
C08G14/14
THERMOPLASTIC-THERMOSET HYBRID RESINS, METHODS, AND USES THEREOF
A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.
POLYBENZOXAZINE PRECURSOR AND METHOD FOR PREPARING SAME
This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.
EXTREME HIGH TEMPERATURE STABLE ADHESIVES AND COATINGS
The present invention provides curable polyimides with low color that are resistant to long term thermo-oxidative degradation. These materials, which include polyimides that are fully aromatic, are synthesized in anisole and are contemplated for use in high temperature applications such as in the aerospace industry and for use as encapsulants for light emitting diodes that will be exposed to high temperatures.
TEMPORARY HIGH-TEMPERATURE-RESISTANT DISPERSING AGENT AND PREPARATION AND USE METHOD THEREOF
A temporary high-temperature-resistant dispersing agent, and a preparation and a use method thereof. The temporary high-temperature-resistant dispersing agent is a block high-molecular polymer prepared by a one-step reaction from polysiloxane containing an amino group. The prepared block high-molecular polymer may be directly used as a dispersant; the block high-molecular polymer may also be used as a basic formula and used as the dispersant after other auxiliary compositions are added; and the block high-molecular polymer may also be used in combination with one or more other dispersion auxiliaries and/or surfactants to meet dispersion requirements in various special occasions.
TEMPORARY HIGH-TEMPERATURE-RESISTANT DISPERSING AGENT AND PREPARATION AND USE METHOD THEREOF
A temporary high-temperature-resistant dispersing agent, and a preparation and a use method thereof. The temporary high-temperature-resistant dispersing agent is a block high-molecular polymer prepared by a one-step reaction from polysiloxane containing an amino group. The prepared block high-molecular polymer may be directly used as a dispersant; the block high-molecular polymer may also be used as a basic formula and used as the dispersant after other auxiliary compositions are added; and the block high-molecular polymer may also be used in combination with one or more other dispersion auxiliaries and/or surfactants to meet dispersion requirements in various special occasions.
Polybenzoxazine precursor and method for preparing same
This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.
PRODUCTION PROCESS OF THE RESINS CONTAINING POLYFLAVONOID AND DERIVATIVES AND THEIR APPLICATION IN THE WOOD BASED COMPOSITE BOARD PRODUCTS
The invention consists of the copolymer resin compound containing the amino group consisting of polyflavonoid and its derivative compounds, amino compounds (urea, monomethylol urea, dimethylolurea, etc.), formaldehyde and stabilizer agents. The shelf life of the produced copolymer resin composition is 1 to 2 months at 18-20 C. The invention is about the said resin's ability to reduce the formaldehyde level of the wood-based composite products without sacrificing board's performance (physical, mechanical testing) values.
PRODUCTION PROCESS OF THE RESINS CONTAINING POLYFLAVONOID AND DERIVATIVES AND THEIR APPLICATION IN THE WOOD BASED COMPOSITE BOARD PRODUCTS
The invention consists of the copolymer resin compound containing the amino group consisting of polyflavonoid and its derivative compounds, amino compounds (urea, monomethylol urea, dimethylolurea, etc.), formaldehyde and stabilizer agents. The shelf life of the produced copolymer resin composition is 1 to 2 months at 18-20 C. The invention is about the said resin's ability to reduce the formaldehyde level of the wood-based composite products without sacrificing board's performance (physical, mechanical testing) values.
HEAT-CURABLE RESIN, COMPOSITION, UNCURED MOLDED OBJECT, PARTLY CURED MOLDED OBJECT, CURED MOLDED OBJECT, AND METHOD FOR PRODUCING HEAT-CURABLE RESIN
Provided are a benzoxazine-based resin which is excellent in plasticity before curing and/or decomposition temperature and toughness before and after curing and a method for producing the benzoxazine-based resin. A thermosetting resin in accordance with an aspect of the present disclosure is a thermosetting resin which has a benzoxazine ring structure in a main chain, the thermosetting resin having: an aromatic group derived from a bifunctional phenol compound (A); and a linear alkylene group derived from an aliphatic diamine compound (B); and optionally a (poly)oxyalkylene group derived from a (poly)oxyalkylenediamine compound (C).
NON-SULFONATED MELAMINE RESIN VISCOSITY REDUCER FOR DRILLING FLUID AND PREPARATION METHOD THEREOF
Provided are a non-sulfonated melamine resin viscosity reducer for a drilling fluid and a preparation method thereof. The non-sulfonated melamine resin viscosity reducer for the drilling fluid includes the following raw materials in parts by mass: 100 parts to 150 parts of water, 80 parts to 100 parts of melamine, 20 parts to 30 parts of formaldehyde, 50 parts to 80 parts of a tannin extract, 40 parts to 60 parts of lignin, 20 parts to 40 parts of maleic anhydride, 0.1 parts to 0.3 parts of a catalyst, 1 part to 3 parts of triethanolamine (TEA), and 10 parts to 20 parts of alcoholamine; wherein the alcoholamine is one or more selected from the group consisting of monoethanolamine (MEA), diethanolamine (DEA), diglycolamine (DGA), isopropanolamine (IPA), and diisopropanolamine (DIPA).