An article includes a substrate with two main faces defining two main surfaces separated by edges, the substrate carrying a functional coating deposited over at least a portion of a main surface and a temporary protective layer deposited over at least a portion of the coating. The temporary protective layer has a thickness of at least 1 micrometer. The temporary protective layer made of polyfuran resin is obtained from a liquid composition comprising furfuryl alcohol.

The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.

A resist underlayer film for lithography does not cause intermixing with a resist layer, has high dry etching resistance and high heat resistance, and generates a low amount of sublimate. A resist underlayer film-forming composition containing a polymer having a unit structure of the following formula (1):

##STR00001##

wherein A is a divalent group having at least two amino groups, the group is derived from a compound having a condensed ring structure and an aromatic group for substituting a hydrogen atom on the condensed ring, and B.sup.1 and B.sup.2 are each independently a hydrogen atom, an alkyl group, a benzene ring group, a condensed ring group, or a combination thereof, or B.sup.1 and B.sup.2 optionally form a ring with a carbon atom bonded to B.sup.1 and B.

A no bake process is provided for preparing a foundry shape. A major amount of an appropriate foundry aggregate, especially a sand that has been mechanically-reclaimed, is mixed with an amount of halloysite tubes. A binder system, especially a water-based binder, such as an aqueous alkaline phenolic resole resin, is added to the mixed aggregate and halloysite, and a liquid co-reactant for curing the binder is also added. By intimately mixing the components, a foundry molding compound is formed and it can be placed into a mold or patter to cure into a foundry shape. When removed from the mold or pattern, the foundry shape can be used to cast molten metal.

A no bake process is provided for preparing a foundry shape. A major amount of an appropriate foundry aggregate, especially a sand that has been mechanically-reclaimed, is mixed with an amount of halloysite tubes. A binder system, especially a water-based binder, such as an aqueous alkaline phenolic resole resin, is added to the mixed aggregate and halloysite, and a liquid co-reactant for curing the binder is also added. By intimately mixing the components, a foundry molding compound is formed and it can be placed into a mold or patter to cure into a foundry shape. When removed from the mold or pattern, the foundry shape can be used to cast molten metal.

A charge-transporting varnish which contains a charge-transporting substance containing fluorine atoms, a charge-transporting substance containing no fluorine atoms, a dopant substance composed of a heteropolyacid, and an organic solvent. The charge-transporting substance containing fluorine atoms is a polymer which is obtained by condensing a triaryl amine compound, an arylaldehyde compound containing fluorine atoms, a fluorene derivative having a carbonyl group and a carbazole derivative having an alkyl group or an alkyl group containing an ether structure in the N-position, and which has a weight average molecular weight of 1,000-200,000. The charge-transporting substance containing no fluorine atoms is an oligoaniline compound. A thin film formed from this charge-transporting varnish is capable of providing an organic EL element having excellent luminance characteristics and durability even in cases where the thin film is used as a single layer between a positive electrode and a light emitting layer in such a manner that the thin film is in contact with the positive electrode and the light emitting layer.

The present invention relates to an aqueous binding composition containing a) a reducing sugar; b) ammonium sulphamate and/or sulphamate of an alkaline or alkaline-earth metal; c) a pH- adjusting agent selected from ammonium hydroxide (NH4OH), an organic and/or inorganic ammonium salt and/or an organic amine; and a resin (or pre-condensate) obtained by reaction of a polyaldehyde, a urea compound and at a lignin sulphonate and/or a condensation derivate thereof with a polyaldehyde, the resin being present in a percentage of at least 10% by weight on the dry weight of the composition. The binder may be efficiently used to bind cotton fibres, cellulose fibres, organic tissues, coal dust, natural and artificial inorganic fibres, thereby obtaining products with good mechanical properties.

This invention relates to aminoplast crosslinker resins compositions based on at least partially alkylated reaction products A of melamine, formaldehyde and an alkanol with the following parameters: the ratio of the amount of substance n(CH.sub.2O) of combined formaldehyde to the amount of substance n(Mel) of melamine is in the range of from 5.6 mol/mol to 6.2 mol/mol, the ratio of the amount of substance n(RO) of alkyl ether groups in the crosslinker resin to the amount of substance n(Mel) of melamine is in the range of from 5.0 mol/mol to 5.6 mol/mol, the mass fraction of monomer in the resin, calculated as the ratio of the mass of monomer m(1) to the mass m(A) of the reaction products A is between 35% and 55%, to a process for their preparation, and to a method of use thereof as crosslinker in combination with hydroxy-functional polymers for coating of heat-sensitive substrates.

There is provided a resist overlayer film forming composition for use in a lithography process in semiconductor device production, which does not intermix with a resist, blocks undesirable exposure light particularly in EUV exposure, for example, UV and DUV and selectively transmits EUV alone, and which can be developed with a developer after exposure. A resist overlayer film forming composition comprising: a polymer including an organic group including a linear or branched saturated alkyl group having a carbon atom number of 1 to 10, in which some or all of hydrogen atoms thereof are substituted with fluorine atoms, and an optionally substituted C.sub.8-16 ether compound as a solvent.

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.