A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and a plurality of pores at the surface of the polymeric body.

A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and a plurality of pores at the surface of the polymeric body.

The presently claimed invention is directed to a polyurea copolymer obtained by reacting an isocyanate mixture and at least one at least one secondary amine having at least two amine functionalities; wherein the isocyanate mixture (A) has an average NCO functionality of ≥2.10.

This invention relates to the use of composite reinforcements advantageously comprising a thermosetting matrix and a filler in particular in the reinforcing of thermoplastic material or of thermosetting resin, in order to obtain a reinforced structure such as a bathtub, a washbasin, a wall panel or a shower tray.

This invention relates more particularly to a method for preparing a reinforced structure using composite reinforcements, as well as the structure able to be obtained by such a method.

A polyurethane, in particular a thermoplastic polyurethane, is obtainable or obtained by reacting at least a polyisocyanate composition and a polyol composition. The polyol composition contains at least one polyester diol or polyether diol, having a number-average molecular weight in the range from 500 to 3000 g/mol, and at least one polysiloxane having two terminal isocyanate-reactive functionalities selected from a thio group, a hydroxyl group, and an amino group. A process can be used for preparing this polyurethane, and a molded body containing the polyurethane is useful. Foam beads based on polyurethane can be obtained or obtainable from the polyurethane, and a process can be used for producing foam beads. Corresponding bead foams are useful.

A polyurethane, in particular a thermoplastic polyurethane, is obtainable or obtained by reacting at least a polyisocyanate composition and a polyol composition. The polyol composition contains at least one polyester diol or polyether diol, having a number-average molecular weight in the range from 500 to 3000 g/mol, and at least one polysiloxane having two terminal isocyanate-reactive functionalities selected from a thio group, a hydroxyl group, and an amino group. A process can be used for preparing this polyurethane, and a molded body containing the polyurethane is useful. Foam beads based on polyurethane can be obtained or obtainable from the polyurethane, and a process can be used for producing foam beads. Corresponding bead foams are useful.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

The present invention relates to a polyurethane, in particular a thermoplastic polyurethane, obtainable or obtained by reacting at least the components (i) to (ii): (i) a polyisocyanate composition; (ii) a polyol composition, comprising (ii.1) at least one polyester diol or polyether diol having a number-average molecular weight in the range from 500 to 3000 g/mol, (ii.2) at least one polysiloxane having two terminal isocyanate-reactive functionalities selected from the group consisting of thio group, hydroxyl group and amino group. The invention additionally relates to a process for preparing this polyurethane, to the use thereof, to a molded body comprising the polyurethane. Furthermore, the invention relates to foam beads based on polyurethane, obtained or obtainable from the polyurethane, to a process for producing foam beads and also to bead foams and to the use thereof.

Provided is an adhesive comprising a reaction product of (A1) an aliphatic isocyanate having an NCO group content of 18 to 64 and (A2) a polyol or polyamine having a molecular weight of from 400 to 4000; and (B) a polyaspartate compound, wherein viscosity of the adhesive, as measured @ 23° C. according to ASTM D4212-16, remains below 60 seconds for after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23° C. according to ASTM D 1876-01 or substrate tear, in less than or equal to five days after the substrate is laminated with the adhesive. The adhesives are free of aromatic amines and may find use in multi-layered laminated films for the production of flexible packaging useful in a variety of industries, including the food processing, cosmetics, and detergents industries.