The present invention is directed towards an electrodepositable coating composition comprising a cationic electrodepositable binder; a phyllosilicate pigment; and a dispersing agent. Also disclosed are methods of making the electrodepositable coating composition, coatings derived therefrom, and substrates coated with the coatings derived from the electrodepositable coating composition.

The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm

A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm.sup.−1 to 2350 cm.sup.−1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm.sup.−1 to 1800 cm.sup.−1 is 0.08 to 1.15.

A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm.sup.−1 to 2350 cm.sup.−1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm.sup.−1 to 1800 cm.sup.−1 is 0.08 to 1.15.

Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.

Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.

A novel primer composition contains aldimine and/or epoxy resins, a process of making such primer to be used in glass bonding adhesive kit.

One embodiment of the present invention provides a curable composition, including a polyfunctional isocyanate compound, a compound selected from the group consisting of a multivalent alcohol and an epoxy compound, and a base amplifier.

A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.

The present invention aims to provide an epoxy resin composition for a fiber-reinforced composite material that maintains low viscosity during injection into reinforcing fibers to realize good impregnating and also has high toughness and high heat resistance and also aims to provide a fiber-reinforced composite material produced therefrom. Also provided is a molding method for a fiber-reinforced composite material including at least a reinforcing fiber [A] and a cured product of an epoxy resin composition [B], wherein the epoxy resin composition [B] includes the components [a], [b], and [c] specified below, and the epoxy resin composition [B] is cured in such a manner that the absorbance ratio Da/(Da+Db) is in the range of 0.4 to 1 in producing the fiber-reinforced composite material: [a] an epoxy resin having at least two oxirane groups in the molecule, [b] an epoxy resin curing agent having at least two isocyanate groups in the molecule, and [c] a catalyst.