In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N═C═O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

A xylylene diisocyanate, a compound represented by the following chemical formula (1), and a compound represented by the following chemical formula (2) are contained in a xylylene diisocyanate composition.

##STR00001##

A xylylenediisocyanate composition including xylylenediisocyanate and a compound represented by Chemical Formula (1) below, wherein 0.6 ppm or more and 60 ppm or less of the compound represented by Chemical Formula (1) below is contained: ##STR00001##

A xylylene diisocyanate, a compound represented by the following chemical formula (1), and a compound represented by the following chemical formula (2) are contained in a xylylene diisocyanate composition. ##STR00001## ##STR00002##

In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N═C═O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

Disclosed is a moisture reactive, polyurethane hot melt adhesive composition that is the reaction product of a first mixture comprising heat stabilizer and only one of polyester polyol or filler, wherein the first mixture can optionally comprise polyether polyol and/or thermoplastic polymer but does not comprise all of heat stabilizer and polyester polyol and filler; polyisocyanate; and a second mixture comprising the other of polyester polyol or filler not present in the first mixture; wherein the second mixture can optionally comprise polyether polyol and/or thermoplastic polymer. The moisture reactive hot melt adhesive can also comprise an additive selected from additional catalyst, additional filler, adhesion promoter, plasticizer, colorant, rheology modifier, flame retardant, UV pigment, nanofiber, defoamer, compatible tackifier, anti-oxidant, stabilizer, thixotrope and mixtures thereof.

A method forming a surface modifying composition with reduced need for organic solvent and evaporation thereof for removal of insoluble reaction byproducts from the composition. The purified composition can be used in the formation of articles having improved biocompatibility, such as medical articles (e.g., spun hollow fiber).

A xylylenediisocyanate composition including xylylenediisocyanate and a compound represented by Chemical Formula (1) below, wherein 0.6 ppm or more and 60 ppm or less of the compound represented by Chemical Formula (1) below is contained:

##STR00001##

A xylylenediisocyanate composition including xylylenediisocyanate and a compound represented by Chemical Formula (1) below, wherein 0.6 ppm or more and 60 ppm or less of the compound represented by Chemical Formula (1) below is contained: ##STR00001##

A xylylene diisocyanate composition according to exemplary embodiments includes xylylene diisocyanate (XDI) and chloromethylbenzyl isocyanate (CBI), and may satisfy a predetermined relationship between an acidity and a content of CBI. Thereby, an optical lens having a high transmittance and improved optical uniformity can be manufactured by controlling a polymerization reaction rate.