Provided are a papermaking device having an excellent strength in which the unevenness in strength between its parts is suppressed, and a method for producing the papermaking device.

Also provided is a papermaking device for use in papermaking machine comprising at least one resin layer comprising polyurethane resin, wherein the polyurethane resin is obtainable by reacting a urethane prepolymer having an isocyanate group with a curing agent having an active hydrogen group, wherein the urethane prepolymer is obtainable by reacting a polyisocyanate compound comprising 2,4-tolylene-diisocyanate and/or 2,6-tolylene-diisocyanate with a polyol compound comprising one or more polyether polycarbonate diol(s).

The invention relates to a method for producing flexible polyurethane foam, flexible polyurethane foam produced by the method, and its use in household articles and automobile articles.

The present invention relates to compounds having one of the following formulae (I) and (II):

##STR(I)##

##STR(II)##

and also to the uses thereof.

The invention provides a polishing pad suitable for polishing at least one of semiconductor, optical, magnetic or electromechanical substrates. It includes a polyurea polishing layer and a polyurea matrix. The polyurea has a soft segment being a copolymer of aliphatic fluorine-free polymer groups and a fluorocarbon having a length of a least six carbons. The polyurea matrix being cured with a curative agent and including gas or liquid-filled polymeric microelements. The polyurea matrix has a bulk region and a transition region adjacent the bulk region that extends to the polishing layer. The polymeric microelements in the transition region decrease in thickness as they approach the polishing layer with thickness of the compressed microelements adjacent the polishing layer being less than fifty percent of a diameter of the polymeric microelements in the bulk region. The polishing layer remains hydrophilic during polishing in shear conditions.

A pressure sensitive adhesive composition includes a polyurethane polymer that includes the reaction product of a polyisocyanate component and a polyol component. The polyol component has a total solubility parameter ranging from 10 to 14 (cal/cm.sup.3).sup.1/2.

In general the present invention relates to polyurethanes based on the reaction of (a) a disocianate composition with (b) depolymerized lignin containing lignin-derived monomers, or the products of their respective functionalization; (c) a polyol composition, if desired (d) chain extenders, if desired. (e) additives, if desired. More specifically, this process relates to the use of depolymerized lignins containing varying amounts of 4-hydroxylalkylphenols or 4-alkylphenols and their derivatives. The polyurethanes can be partially or fully bio-based. Furthermore, the invention relates to a method for preparing these polyurethanes and to their use.

Polymer polyols (“PMPOs”), processes for their production, and the use of such PMPOs, particularly in the production of flexible polyurethane foams. The PMPOs are produced using an ethylenically unsaturated composition that includes a crosslinker that results in crosslinks in the PMPO polymer particles that may decompose when exposed to flame temperatures. The PMPOs is capable of providing a flexible polyurethane foam that may exhibit combustibility resistance properties.

In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

The present invention relates to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to an embodiment can achieve low hardness by comprising a polishing layer formed using a curing agent of specific components. It is possible to enhance the mechanical properties of the polishing pad, as well as to improve the surface defects appearing on the surface of a semiconductor substrate, by controlling the surface roughness reduction rate and the recovery elasticity index of the polishing pad to specific ranges. It is also possible to further enhance the polishing rate.

The present invention provides an environment-responsive laminated film including an inorganic thin film layer and a protective layer in this order on a substrate film layer using a polyester resin recycled from PET bottles. The laminated film has excellent barrier properties and adhesiveness even after a severe wet heat treatment and has less deterioration in appearance of the film even after retorting. The laminated film comprises a substrate film; an inorganic thin film layer on at least one surface of the substrate film; and a protective layer containing a urethane resin on the inorganic thin film layer, wherein (a) the substrate film contains 50% by weight or more of a polyester resin recycled from PET bottles; (b) standard deviation of a haze after retorting the laminated film at 130° C. for 30 minutes is 0.5% or less; and (c) an adhesion amount of the protective layer is 0.5 g/m.sup.2 or less.