An aqueous emulsion contains a copolymer having three components: a) to c). Component a) has at least one biuret or isocyanurate substructure. Component b) is selected from polysiloxanes and polyhydrocarbons, preferably polysiloxanes. Component c) contains a hydrocarbon which is different from component b) and has at least 6 carbon atoms and not more than 3 heteroatoms selected from N, O, and S. Component b) is joined to 2 different or identical components a) via at least two positions.

Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.

Provided is an aqueous coating composition which has excellent storage stability and whereby high coating film performance in terms of hardness, water resistance, etc., can be exhibited even when the aqueous coating composition is cured at a relatively low temperature. Disclosed is an aqueous coating composition which contains (A) a resin containing hydroxyl groups and carboxyl groups, (B) a blocked polyisocyanate compound, (C) a phosphate-group-containing compound, and (D) a basic compound, and which has a pH in the range of 7.0-8.2, wherein the basic compound (D) contains a specific quantity of (D1) a basic compound which has an acid dissociation constant (PKa) in the range of 7.0-8.5 and a boiling point in the range of 100-200° C.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

A coating composition includes a coating resin, a triazine ultraviolet light absorber of Formula (I), and a hindered light amine stabilizer, where Formula (I) has the structure: ##STR00001##

A method for deblocking a blocked isocyanate is described herein. The method includes contacting a blocked isocyanate and a halide ion source under conditions effective to provide a deblocked isocyanate. A method of making a polyurethane is also disclosed. The method of making a polyurethane includes combining a blocked isocyanate, a polyol, and a halide ion source in the presence of solvent and under conditions effective to provide the polyurethane.

The present invention relates to a polymerisable plasticiser formed by a hydrocarbon chain, one end of which bears more than one isocyanate function, said hydrocarbon chain comprising and/or being substituted by an aromatic ring and/or an aliphatic ring and/or said hydrocarbon chain is substituted by at least two hydrocarbon chains that can comprise an unsaturation, and the number of isocyanate functions being strictly greater than 1, preferably greater than 1.2, and, more preferably, grater than 1.5 but less than or equal to 2.2. The invention also relates to liquid polyurethane resin compositions and, in particular, stable, ready-to-use liquid polyurethane resin compositions comprising said plasticiser. The invention further relates to methods for replacing all or part of the exogenous plasticiser and/or solvent in a polyurethane resin by adding said polymerisable plasticiser.

An adhesive agent produced by crosslinking an adhesive agent composition containing a polyester resin (i) having a structural portion derived from a polycarboxylic acid compound (a) and a structural portion derived from a polyol component (b), wherein the polyester resin (i) contains a structural portion derived from at least one selected from the group consisting of a dimer acid compound, a sebacic acid compound, and a dimer diol in a proportion of not less than 60 wt. % based on the weight of the polyester resin (i), wherein the polyol component (b) includes a glycol (b1) having an even carbon number (excluding the dimer diol), wherein the polyester resin (i) has an ester group concentration of not less than 2 mmol/g. The adhesive agent has an adhesive force (α) of not less than 1 N/25 mm as measured under predetermined conditions.

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.