There is provided a conductive composite having excellent conductivity and able to form a conductive film with which film loss in a resist layer is low. The conductive composite of the present invention includes a conductive polymer and a surfactant. When a critical micelle concentration of the surfactant is less than 0.1% by mass, a content of the surfactant is 5 parts by mass or more with respect to 100 parts by mass of the conductive polymer. In addition, when the critical micelle concentration of the surfactant is 0.1% by mass or more, the content of the surfactant is more than 100 parts by mass with respect to 100 parts by mass of the conductive polymer.

An interpenetrating network (IPN) polymer membrane material includes a soft polyurethane interspersed with a crosslinked conducting polymer. The material can be reversibly “switched” between its oxidized and reduced states by the application of a small voltage, ˜1 to 4 volts, thus modulating its diffusivity.

An interpenetrating network (IPN) polymer membrane material includes a soft polyurethane interspersed with a crosslinked conducting polymer. The material can be reversibly “switched” between its oxidized and reduced states by the application of a small voltage, ˜1 to 4 volts, thus modulating its diffusivity.

Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.

A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; X.sup.M1, X.sup.M2 are each O; R.sup.M1, R.sup.M2 are the same or different and are each an —CR.sup.aR.sup.b—Ar—O—R.sup.c; Ar is a C.sub.6 to C.sub.30 carbocyclic ring system; R.sup.a, R.sup.b are the same or different and are each H or C.sub.1 to C.sub.6 alkyl; R.sup.c is C.sub.1-C.sub.22-alkyl, benzyl or phenyl; q according to the valency and charge of M is 0 or 1; X.sup.M3, X.sup.M4 are the same or different and are each O, C.sub.6 to C.sub.10 aryl, or —CH.sub.2—; R.sup.M3, R.sup.M4 are the same or different and are each R.sup.M1, H, C.sub.1-C.sub.22 alkyl, or a polymer selected from a polyalkylene, a polysiloxane, or a polyether.

##STR00001##

A method for producing a hydrogenated ring-opening metathesis polymer includes subjecting a cyclic olefin to ring-opening metathesis polymerization in the presence of a polymerization catalyst to produce a ring-opening metathesis polymer, and hydrogenating at least some of carbon-carbon double bonds of the ring-opening metathesis polymer, at least one ruthenium compound selected from a group made of a ruthenium compound represented by a formula (I), (II), (III), and (IV) being used as the polymerization catalyst; and a resin composition having a hydrogenated ring-opening metathesis polymer produced by this method. It is possible to industrially advantageously produce a hydrogenated ring-opening metathesis polymer that exhibits especially excellent light transmittance.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be

##STR00001##

or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen

##STR00002##

or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is

##STR00003##

wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is

##STR00004##

wherein e is 0-10.

This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.

Oxacycloolefinic polymers as typically obtained by metathesis polymerization using Ru-catalysts, show good solubility and are well suitable as dielectric material in electronic devices such as capacitors and organic field effect transistors.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).