Patent classifications
C08G2650/50
POLYETHERAMINES WITH LOW MELTING POINT
Described herein are substituted polyetheramines with a low melting point which are obtainable by condensation of at least two N-(hydroxyalkyl)amines to obtain a polyetheramine and subsequent reaction of at least one remaining hydroxy group and/or, if present, at least one secondary amino group of said polyetheramine with ethylene oxide and at least one further alkylene oxide to obtain a substituted polyetheramine. Uses of such substituted polyetheramines in fields of cosmetic formulations, as crude oil emulsion brakers, in pigment dispersions of ink jets, in electro paintings, or in cementitious compositions as well as methods wherein said substituted polyetheramines are used in said fields are described herein.
CRYSTALLINE POLYETHERNITRILE
A crystalline polyethernitrile with a difference between a melting point and a crystallization temperature at a time of temperature-fall being 40° C. or more and 100° C. or less, the crystalline polyethernitrile includes N repeating units represented by Formula (I) and M repeating units represented by Formula (II), N and M being integers satisfying 0.90<[N/(N+M)]<1.00:
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in Formulas (I) and (II), Ar.sup.1 and Ar.sup.2 have one framework selected from units represented by Formula (a) to Formula (f), with a proviso that Ar.sup.1 and Ar.sup.2 are not the same,
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Bio-based diols from sustainable raw materials, uses thereof to make diglycidyl ethers, and their coatings
The invention relates to diols derived from 5-hydroxymethyl furfural, diformyl furan, or derivatives thereof. The invention further relates to diglycidyl ethers derived from the diols of the invention, curable coating compositions containing the diglycidyl ethers, and objects coated with the curable coating compositions. The invention also relates to composites, composites, adhesives, and films containing the diglycidyl ethers of the invention. The invention also relates to methods of making the diols, diglycidyl ethers, and curable coating compositions.
HARDENER FOR EPOXY CASTING RESINS
A hardener for epoxy resins includes at least one amine of the formula (I) and an amine-functional adduct of at least one polyoxyalkylene polyamine and a diepoxide. The hardener enables transparent epoxy resin compositions of high clarity, which are free of toxic diluents such as nonylphenol, upon curing show a low heat generation but still cure fast and reliably and have a high robustness against yellowing. Such epoxy resin compositions are particularly suitable as casting resin for the manufacturing of transparent articles with a glass-like appearance.
Thermosetting epoxy resin composition for the preparation of articles for electrical engineering, and the articles obtained therefrom
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##
A CURABLE COMPOSITION AND A METHOD FOR ADHERING SUBSTRATES WITH THE SAME
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening-compatibilizing agent which has at least one silane group and at least two amine groups. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
NOVEL BIO-BASED DIOLS FROM SUSTAINABLE RAW MATERIALS, USES THEREOF TO MAKE DIGLYCIDYL ETHERS, AND THEIR COATINGS
The invention relates to diols derived from 5-hydroxymethyl furfural, diformyl furan, or derivatives thereof. The invention further relates to diglycidyl ethers derived from the diols of the invention, curable coating compositions containing the diglycidyl ethers, and objects coated with the curable coating compositions. The invention also relates to composites, composites, adhesives, and films containing the diglycidyl ethers of the invention. The invention also relates to methods of making the diols, diglycidyl ethers, and curable coating compositions.
TWO-PART THERMAL CONDUCTIVE EPOXY ADHESIVE COMPOSITION
The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.
Microstructured Film Comprising Polyalkylene Oxide Block Copolymer, Compositions and Methods
An article (e.g. film, tape or pipe) is described comprising a microstructured surface. The microstructured surface comprises a thermoplastic polymer; and a block copolymer additive comprising a poly(alkylene)oxide block having a molecular weight greater than 250 or 500 g/mole and at least one hydrophobic block. Also described is a method of making such articles. Also described is a triblock copolymer comprising a poly(alkylene oxide) midblock and hydrocarbon end blocks; and compositions comprising a thermoplastic polymer and un to 50 wt. % of the block copolymer.
AMPHIPHILIC BLOCK COPOLYMER
The invention relates to block copolymer comprising i) A first block wherein at least 65 mol-% of the repeating units of the first block are repeating units of the formula (I)—[CH.sub.2—CH.sub.2—O]—, ii) A second block wherein at least 90 mol-% of the repeating units of the second block are repeating units of at least one of formulae (II) or (III), wherein the groups R.sup.1, R.sup.2, and R.sup.3 independent of each occurrence are selected from hydrocarbyl groups having 1 to 40 carbon atoms, which are optionally substituted by ether or hydroxyl groups, and wherein the groups R.sup.1 and R.sup.2 are optionally linked to each other such that a nitrogen heterocyclic structure is present, iii) A third block which is different from the first block and the second block and which is more hydrophobic than the first block.
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