C08G59/027

CURED EPOXY RESIN COATING
20230021884 · 2023-01-26 ·

A coating for coating a substrate, includes an epoxy resin derived from an oil and cured using a curing agent including a mixture of a carboxylic acid having at least two acid functionalities and an ester.

Polyether-modified polybutadienes and processes for preparation thereof

A process can be used for preparing polyether-modified polybutadienes. The process involves reacting at least one polybutadiene (A) with at least one epoxidizing reagent (B) to give at least one epoxy-functional polybutadiene (C). The at least one epoxy-functional polybutadiene (C) is then reacted with at least one hydroxy-functional compound (D) to give at least one hydroxy-functional polybutadiene (E). The at least one hydroxy-functional polybutadiene (E) is finally reacted with at least one epoxy-functional compound (F) to give at least one polyether-modified polybutadiene (G).

Composition and method
11692096 · 2023-07-04 · ·

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

FURANIC DIGLYCIDYL ETHERS AND ESTERS AND USE THEREOF

The present disclosure provides diglycidyl ethers and esters of 2,4-furandimethanol (2,4-FDME) and of 2,4-furandicarboxylic acid (2,4-FDCA), methods of making diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, and methods of making epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA.

Polyester-polyether-modified polybutadienes and processes for preparation thereof

Compounds are based on polyether-modified polybutadiene, where the polyether-modified polybutadiene contains repeat units selected from the divalent radicals:

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The radical B has at least one ester group.

ADDITIVELY MANUFACTURING BIO-BASED CONDUCTIVE SHAPE MEMORY POLYMER MACOSTRUCTURE PARTS WITH HIGHLY ORDERED MICROSTRUCTURES

An additive manufacturing apparatus includes an additive manufacturing print head and a nozzle that receives a bio-based shape memory polymer material and a bio-based material. The nozzle extrudes the bio-based shape memory polymer material and the bio-based material onto a substrate to form a bio-based shape memory polymer part or product.

Universal adhesion promoter based on organofunctional modified polybutadienes

A universal adhesion promoter contains a compound based on polybutadiene having at least one repeat unit selected from the following divalent radicals:

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Defoamer composition based on organofunctionally modified polybutadienes

A defoamer composition contains a compound based on polybutadiene having at least one repeat unit selected from the divalent radicals:

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EPOXIDE WITH LOW TOTAL CHLORINE CONTENT AND NO HEAVY METAL RESIDUES AND PREPARATION METHOD THEREOF
20220363653 · 2022-11-17 ·

The present disclosure relates to the field of epoxide resin, and more particularly to an epoxide with a low total chlorine content and no heavy metal residues, and a preparation method thereof. Disclosed is an epoxide prepared from raw materials including an unsaturated cycloaliphatic compound containing a double bond, hydrogen peroxide, an organic acid compound, a solvent and an alkaline salt; wherein a molar ratio of the organic acid compound to the unsaturated cycloaliphatic compound containing a double bond is (1-1.5):1. The obtained epoxides obtained in the present disclosure have a high purity, a high yield, a low solvent content, low chroma, and a low chlorine and metal ion content; the reaction system is simple, environmentally friendly, safe and controllable, and the production cost is low, which can meet the technical and economic requirements and are suitable for large-scale industrial production.

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING HETEROCYCLIC COMPOUND
20220356297 · 2022-11-10 · ·

A resist underlayer film having an especially high dry etching rate; a composition for forming the resist underlayer film; a method for forming a resist pattern; and a method for producing a semiconductor device. The composition for forming the resist underlayer film has a solvent and a product of reaction between an epoxidized compound and a heterocyclic compound containing at least one moiety having reactivity with an epoxy group. It is preferable that the heteroring contained in the heterocyclic compound be selected from among furan, pyrrole, pyran, imidazole, pyrazole, oxazole, thiophene, thiazole, thiadiazole, imidazolidine, thiazolidine, imidazoline, dioxane, morpholine, diazine, thiazine, triazole, tetrazole, dioxolane, pyridazine, pyrimidine, pyrazine, piperidine, piperazine, indole, purine, quinoline, isoquinoline, quinuclidine, chromene, thianthrene, phenothiazine, phenoxazine, xanthene, acridine, phenazine, and carbazole.