A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

The present embodiments generally relate to a technology for improving Cu/Mo grade by the addition of cationic polymers as selective depressants for acid insoluble matters, e.g., silicates and/or clays, in the flotation circuit. Various types of cationic polymers are demonstrated to be effective depressants including polyamine, polyDADMAC, and cationic polyacrylamide. Also disclosed are processes for enriching a desired mineral from an ore comprising the desired mineral and gangue, wherein the process comprises carrying out a flotation process in the presence of one or more cationic polymer depressants.

The present embodiments generally relate to a technology for improving Cu/Mo grade by the addition of cationic polymers as selective depressants for acid insoluble matters, e.g., silicates and/or clays, in the flotation circuit. Various types of cationic polymers are demonstrated to be effective depressants including polyamine, polyDADMAC, and cationic polyacrylamide. Also disclosed are processes for enriching a desired mineral from an ore comprising the desired mineral and gangue, wherein the process comprises carrying out a flotation process in the presence of one or more cationic polymer depressants.

An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows:

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and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows:

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and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

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The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

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Described herein is an aqueous resin dispersion (AD) including a resin component (R) including at least one di- and/or polyfunctional monomeric primary and/or secondary amine (M) and polyfunctional polymeric organic amines having primary and/or secondary amino groups. Also described herein is an aqueous two-component coating composition including the resin dispersion.