An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition.

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The definition of Chemical Formula 1 is as described in the detailed description.

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: ##STR00001##

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: ##STR00001##

The ester-type epoxy furan resin of the present invention is represented by the following general formula (1).

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(In the general formula (1), R.sup.1 is an alkylene group having 2 to 6 carbon atoms optionally containing a hydroxy group; R.sup.2 and R.sup.3 are each an alkyl group having 1 to 4 carbon atoms, and R.sup.2 and R.sup.3 may be bonded to each other to form a cyclic structure; n is 0 to 300; and a plurality of R.sup.1, R.sup.2, and R.sup.3, if present within the molecule, may be mutually the same or different.)

Compounds can be used as catalysts, particularly in ring-opening polymerization reactions, including ring-opening co-polymerization (ROCOP) reactions, or in isocyanate trimerization reactions. The compounds have the formula L-M-X.sub.n, where L is a pyridyl-bis(iminophenolate) ligand, M is a metal ion, X is a co-ligand to balance the charge of the compound, and n is an integer from 0 to 7. The compounds can be prepared by base condensation of a pyridyl-diamine compound with an aldehyde or ketone.

Compounds can be used as catalysts, particularly in ring-opening polymerization reactions, including ring-opening co-polymerization (ROCOP) reactions, or in isocyanate trimerization reactions. The compounds have the formula L-M-X.sub.n, where L is a pyridyl-bis(iminophenolate) ligand, M is a metal ion, X is a co-ligand to balance the charge of the compound, and n is an integer from 0 to 7. The compounds can be prepared by base condensation of a pyridyl-diamine compound with an aldehyde or ketone.

The present invention relates to a process for the manufacture of an epoxy-functional polyester, and to solid epoxy-functional polyesters made by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester. The polyester made as disclosed herein is particularly useful in powder coatings.

The present invention relates to a process for the manufacture of an epoxy-functional polyester, and to solid epoxy-functional polyesters made by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester. The polyester made as disclosed herein is particularly useful in powder coatings.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.