The invention relates to a mixture of at least one dialkylphosphinic acid of the formula (I)

##STR00001##

in which R.sup.1, R.sup.2 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl, C.sub.7-C.sub.18-alkylaryl, with at least one different dialkylphosphinic acid of the formula (II)

##STR00002##

in which R.sup.3, R.sup.4 are the same or different and are each C.sub.1-C.sub.18-alkyl, C.sub.2-C.sub.18-alkenyl, C.sub.6-C.sub.18-aryl and/or C.sub.7-C.sub.18-alkylaryl, with the proviso that at least one of the R.sup.3 and R.sup.4 radicals is different than R.sup.1 and R.sup.2.

The invention is directed to a method for attaching nanomaterials containing hexagonal lattices to polymer surfaces. For example, carbon nanotubes (CNTs) can be attached to polycarbonate, polyethylene, or epoxy surfaces by amination of the polymer surface, functionalization of the surfaces of CNTs with ester groups, and reacting the aminated surface of the polymer with the ester groups of the functionalized surfaces of the CNTs in an organic solvent to chemically bind the CNTs to the polymer surface.

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

A process can be used for preparing polyether-modified polybutadienes. The process involves reacting at least one polybutadiene (A) with at least one epoxidizing reagent (B) to give at least one epoxy-functional polybutadiene (C). The at least one epoxy-functional polybutadiene (C) is then reacted with at least one hydroxy-functional compound (D) to give at least one hydroxy-functional polybutadiene (E). The at least one hydroxy-functional polybutadiene (E) is finally reacted with at least one epoxy-functional compound (F) to give at least one polyether-modified polybutadiene (G).

The present invention is directed to the use as a reactive component in the curing of compositions based on epoxy resins of a functionalized α-angelica lactone (XOMAL) having the general formula: ##STR00001##
wherein: R.sup.a is a C.sub.1-C.sub.30 alkyl, C.sub.3-C.sub.30 cycloalkyl, C.sub.6-C.sub.18 aryl or C.sub.2-C.sub.12 alkenyl group.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

A method for improving corrosion resistance of vinyl ester resin is provided, which belongs to the technical field of polymer materials. The method includes adding vinyl ester resin into a MXene nanosheet solution and evaporating the solvent; then adding cobalt isooctoate promoter and butanone peroxide initiator in sequence, standing for curing after defoaming, and then heating.

Coating compositions and methods providing a high build, fast drying, fast hardening non-amine containing aqueous latex binders are provided, wherein the coating composition is applied to a substrate at a wet film thickness to about 15 mils that ensure drying times of less than 10 minutes. The binder requires the use of at least one specific coalescent solvent with both anionic and non-anionic surfactants.

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.