A method for preventing hardener compounds to be formed from hardener precursors in an aerosol formulation suitable for use in aerosol for making a paint is disclosed.

A bio-based resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.

The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.

An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; iii) a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.

The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.

A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.