The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a surface, the adhesive remaining uncured until activated by application of a threshold pressure. The adhesive comprises a matrix comprising a hardener and a plurality of microcapsules filled with an adhesive resin, the microcapsules being configured to rupture on application of the threshold pressure, thereby exposing the resin to the matrix and allowing the resin to react with the hardener to form an adhesive bond between the decorative element and the surface. The matrix may further comprise a rheology additive such that the matrix has a higher viscosity than the hardener at room temperature. Methods of making an adherable element, and decorative articles comprising the adherable element are also disclosed.

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

Curable epoxy resin compositions are provided that are mixtures containing an epoxy resin and composite particles. The composite particles have a porous polymeric core, a nitrogen-based curing agent for an epoxy resin positioned within the porous polymeric core, and a coating layer around the porous polymeric core. The nitrogen-containing curing agent typically does not react with the epoxy resin until the curable composition is heated causing the release of the nitrogen-containing curing agent from the composite particle. Additionally, cured epoxy resins formed from the curable composition and method of forming cured epoxy resins are provided.

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).

A method for nanoencapsulation of an amine adduct in a polymeric shell includes steps of emulsifying a first aqueous solution including the amine adduct into an organic solution including an organic solvent and a polymer to obtain a primary emulsion; emulsifying the primary emulsion into a second aqueous phase including a stabilizer to obtain a secondary emulsion; removing the organic solvent by evaporation to form solid nanocapsules; and separating the formed solid nanocapsules by centrifugation. The nanocapsules have an average size of between about 30 nm and about 597 nm.

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, in which an aluminum chelate-based curing agent is held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and the surface of the aluminum chelate-based latent curing agent has been subjected to inactivation treatment with an alkoxysilane coupling agent. An alkylalkoxysilane is preferred as the alkoxysilane coupling agent. The radical polymerizable compound preferably contains a polyfunctional radical polymerizable compound.